Abstract: A suction desoldering tool has an elongate handle, an elongate housing defining a bore therethrough and extending co-axially from one end of the handle solder, a collecting chamber in the handle, and a tubular heating bit holder. The holder is mounted in the end of the housing remote from the body and includes a body portion surrounded by an electric heating element for receiving the bit and a tubular portion of lesser wall thickness providing communication between the bit and collecting chamber. The tubular portion is surrounded by an imperforate sleeve which defines an insulating air space along the tubular portion to enable the full length of tubular portion to be maintained above the liquidus temperature for solder melted by the bit during a desoldering operation, so that the melted solder can be drawn into the collecting chamber through the bit and holder by a source of suction connected to the chamber.