Abstract: A device for generating singlet oxygen is provided. The device has a sensitizer that converts triplet oxygen to single oxygen upon exposure to light. The device is configured to keep the sensitizer from contacting external fluids.

Abstract: A device for generating singlet oxygen is provided. The device has a sensitizer that converts triplet oxygen to single oxygen upon exposure to light. The device is configured to keep the sensitizer from contacting external fluids.

Abstract: A device for generating singlet oxygen is provided. The device has elongated posts extending from a surface, the lateral sides of which have particles with a sensitizer that converts triplet oxygen to single oxygen upon exposure to light. An optical fiber conveys light to the sensitizer and a gas supply tube conveys oxygen to the sensitizer. The device is configured to keep the sensitizer from contacting external fluids, such as saliva.

Abstract: A method for forming a superhydrophobic surface is disclosed. A surface of a first substrate is bonded to a surface of a second substrate to form a stacked material. The stacked material is peeled apart to form a fracture line and provide a superhydrophobic surface.

Abstract: A method for forming a superhydrophobic surface is disclosed. A surface of a first substrate is bonded to a surface of a second substrate to form a stacked material. The stacked material is peeled apart to form a fracture line and provide a superhydrophobic surface.

Abstract: A hybrid substrate is provided that facilitates dropwise condensation and self-cleaning. The substrate has hydrophilic regions surrounded by hydrophobic regions. Water preferentially condenses on the hydrophilic regions. The hydrophilic regions are arranged to promote removal of the condensed water.

Abstract: A device for generating singlet oxygen is provided. The device has elongated posts extending from a surface, the lateral sides of which have particles with a sensitizer that converts triplet oxygen to single oxygen upon exposure to light. An optical fiber conveys light to the sensitizer and a gas supply tube conveys oxygen to the sensitizer. The device is configured to keep the sensitizer from contacting external fluids, such as saliva.

Abstract: A low-cost method is provided for fabricating a nano-droplet plate with surface features having re-entrant (anvil-like) geometries capable of holding droplets of a precise, predetermined volume. Such structures are useful for a variety of applications, including cull culturing, high-throughput screening of therapeutics and as microwells.

Abstract: A method for forming a superhydrophobic surface is disclosed. A surface of a first substrate is bonded to a surface of a second substrate to form a stacked material. The stacked material is peeled apart to form a fracture line and provide a superhydrophobic surface.

Abstract: Apparatus including a rigid fluid-permeable body, having a first non-planar fluid-permeable body surface, and having a second fluid-permeable body surface; a plurality of fluid-permeable cells in the fluid-permeable body; and a plurality of raised micro-scale features on the first fluid-permeable body surface. Apparatus including a fluid-permeable body having first and second fluid-permeable body surfaces; a plurality of fluid-permeable cells in the fluid-permeable body; a plurality of raised micro-scale features on the first fluid-permeable body surface; and a fluid containment body forming, together with the second fluid-permeable body surface, a second fluid containment structure. Methods, utilizing an apparatus, of treating a liquid with a fluid, and of maintaining a superhydrophobic surface.

Abstract: An apparatus includes a body containing a vapor chamber and having first and opposing second major surfaces and a thermoelectric module having first and opposing second major surfaces. The second major surface of the body is in thermal contact with the first major surface of the thermoelectric module. A heat sink has a first major surface in thermal contact with the second major surface of the thermoelectric module. The thermoelectric module is configured to control a flow of heat between the body and the heat sink.

Abstract: Apparatus including a rigid fluid-permeable body, having a first non-planar fluid-permeable body surface, and having a second fluid-permeable body surface; a plurality of fluid-permeable cells in the fluid-permeable body; and a plurality of raised micro-scale features on the first fluid-permeable body surface. Apparatus including a fluid-permeable body having first and second fluid-permeable body surfaces; a plurality of fluid-permeable cells in the fluid-permeable body; a plurality of raised micro-scale features on the first fluid-permeable body surface; and a fluid containment body forming, together with the second fluid-permeable body surface, a second fluid containment structure. Methods, utilizing an apparatus, of treating a liquid with a fluid, and of maintaining a superhydrophobic surface.

Abstract: The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Abstract: Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. The PWB is provided with an aperture which is smaller than the size of the silicon substrate but larger than the outside dimensions of the mounted chips. The substrate is positioned on the PWB so that its ends overlap areas of the PWB adjacent the aperture and the chips fit into the aperture. Peripheral metallizations on the substrate are interconnected to metallizations on the PWB by either solder reflow technology or conductive adhesive technology.

Abstract: A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB.

Abstract: Magnetic circuit elements, e.g. for inclusion on circuit boards including one or more windings about a toroidal core are produced by joinder of mating sheets, one or both recessed to hold the core, and each containing partial windings. Joinder is by use of an anisotropically conducting adhesive layer. The layer is applied as an uncured thermosetting adhesive containing spherical conducting particles of such size and distribution as to statistically result in electrical completion of windings while avoiding turn-to-turn shorting.

Abstract: Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the articles are cooled. During the heating step, inert gas is flowed over the articles.

Abstract: Electrically conductive paths are produced on a polymeric substrate by laser writing, i.e., by tracing desired paths on the substrate by a laser beam. The resulting paths comprise electrically conductive carbon as produced by thermal decomposition of substrate surface material; the paths can serve; e.g., as electrical interconnections akin to printed circuitry on a wiring board. Optionally, the conductivity of paths can be enhanced by electroplating a suitable conductor metal or alloy onto the paths.