Patents by Inventor Alan Mark Cohen

Alan Mark Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation assembly for computing devices
    Patent number: 7768782
    Abstract: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: August 3, 2010
    Inventor: Alan Mark Cohen
  • Heat dissipation assembly for computing devices
    Patent number: 7595987
    Abstract: Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing speed. A heat sink is provided in thermal contact with a microprocessor whereby a water barrier is applied to and proximate a socket configured within the computing device's motherboard for preventing water of condensation from contacting areas covered by the water barrier.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: September 29, 2009
    Inventor: Alan Mark Cohen
  • HEAT DISSSIPATION ASSEMBLY FOR COMPUTING DEVICES
    Publication number: 20090213539
    Abstract: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
    Type: Application
    Filed: May 6, 2009
    Publication date: August 27, 2009
    Applicant: H Christian Gunderson
    Inventor: Alan Mark Cohen
  • Heat dissipation assembly for computing devices
    Patent number: 7551441
    Abstract: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: June 23, 2009
    Inventor: Alan Mark Cohen
  • Heat dissipation assembly for computing devices
    Patent number: 7292437
    Abstract: Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing speed. A heat sink is provided in thermal contact with a microprocessor whereby a water barrier is applied to and proximate a socket configured within the computing device's motherboard for preventing water of condensation from contacting areas covered by the water barrier.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: November 6, 2007
    Inventor: Alan Mark Cohen