Abstract: A memory supermodule containing two or more memory modules disposed on a common circuit board. Also, a memory supermodule comprising two or more memory modules, each module comprising a circuit board, the circuit boards connected by a flexible circuit. All modules in a supermodule share a single set of contact pads for establishing signal connection with a system in which the supermodule is used.

Abstract: A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.