Patents by Inventor Alan Moe

Alan Moe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal Mass Compensated Dielectric Foam Support Structures for Coaxial Cables and Method of Manufacture
    Publication number: 20110131802
    Abstract: A method for manufacturing a coaxial cable wherein an inner conductor is coated with an adhesive solid or high-density foam polymer or blend. The adhesive solid or high density foam polymer or blend surrounding the inner conductor is provided with a thickness at least 30 percent of the inner conductor diameter. The adhesive solid or high-density foam polymer or blend is surrounded with a foam dielectric. The foam dielectric is surrounded with an outer conductor.
    Type: Application
    Filed: February 1, 2011
    Publication date: June 9, 2011
    Applicant: ANDREW LLC
    Inventors: Mark Witthoft, Alan Moe
  • Thermal mass compensated dielectric foam support structures for coaxial cables and method of manufacture
    Patent number: 7902456
    Abstract: Thermal mass compensated foam support structures for coaxial cables such as inner conductors and or inner conductor support structures. The foam support structures provided with an adhesive solid or high density foam polymer or blend layer to increase the thermal mass of the support structure enough to allow the foam to surround the adhesive solid or high density foam polymer or blend layer without forming unacceptably large voids in the foam dielectric as the foam dielectric cures.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: March 8, 2011
    Assignee: Andrew LLC
    Inventors: Mark Witthoft, Alan Moe
  • Thermal Mass Compensated Dielectric Foam Support Structures for Coaxial Cables and Method of Manufacture
    Publication number: 20090020310
    Abstract: Thermal mass compensated foam support structures for coaxial cables such as inner conductors and or inner conductor support structures. The foam support structures provided with an adhesive solid or high density foam polymer or blend layer to increase the thermal mass of the support structure enough to allow the foam to surround the adhesive solid or high density foam polymer or blend layer without forming unacceptably large voids in the foam dielectric as the foam dielectric cures.
    Type: Application
    Filed: September 23, 2008
    Publication date: January 22, 2009
    Applicant: ANDREW LLC
    Inventors: Mark Witthoft, Alan Moe