Patents by Inventor Alan Oshinski

Alan Oshinski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance thermoplastic compositions with improved melt flow properties
    Patent number: 7019062
    Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: March 28, 2006
    Assignee: General Electric
    Inventors: Franciscus Johannes Maria van Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
  • Nanocomposite comprising stabilization functionalized thermoplastic polyolefins
    Publication number: 20050203235
    Abstract: This invention relates to nanocomposites comprising organo-clay and at least one stabilization functionalized thermoplastic polyolefin. Preferably the stabilization functionalized thermoplastic polyolefin is represented by the formula: T-(R1G)n Wherein T represents the thermoplastic polyolefin Each R1 is a bridging group, preferably independently selected from the group consisting of C1 to C20 aliphatic; C1 to C20 aromatic; substituted C1 to C20 aliphatic; substituted C1 to C20 aromatic; C1 to C20 aliphatic ester; C1 to C20 aliphatic ether; C1 to C20 aliphatic amide; C1 to C20 aliphatic imide; n is the number of stabilization functional/bridging groups bound to T and may be from 1-300; and G is selected from one or more of phenols, ketones, hindered amines, substituted phenols, substituted ketones, substituted hindered amines, or combinations thereof.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 15, 2005
    Inventors: Caiguo Gong, Alan Oshinski, Beverly Poole, Jerry Ball, Thomas Sykes
  • High performance thermoplastic compositions with improved melt flow properties
    Patent number: 6673872
    Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: January 6, 2004
    Assignee: General Electric Company
    Inventors: Franciscus Johannes Maria van Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
  • High performance thermoplastic compositions with improved melt flow properties
    Publication number: 20030225221
    Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
    Type: Application
    Filed: May 6, 2003
    Publication date: December 4, 2003
    Inventors: Franciscus Johannes Maria van Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
  • HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES
    Publication number: 20030125478
    Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
    Type: Application
    Filed: May 17, 2000
    Publication date: July 3, 2003
    Inventors: Franciscus Johannes Mari Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
  • Conductive compositions with compositionally controlled bulk resistivity
    Patent number: 6221283
    Abstract: The invention relates to a method of making a conductive thermoplastic composition containing at least one dispersed phase polymer with a continuous phase polymer and at least one conductivity imparting agent wherein the bulk resistivity of the composition is at least partially determined by the particle size of the dispersed phase within the continuous phase. The thermoplastic composition preferably comprises a compatibilized blend of at least one polyphenylene ether resin, at least one polyamide resin, and at least one conductivity imparting agent, and optionally, one or more of impact modifiers, stabilizers, antioxidants, lubricants, and fillers.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: April 24, 2001
    Assignee: General Electric Company
    Inventors: Raja Dharmarajan, Robert Hossan, Biswaroop Majumdar, Alan Oshinski, Christiaan H. Koevoets, Jan P H Keulen, Antoinette C. van Bennekom, Johannes Matthijssen, Ilse Schlosser