Abstract: An improved electronic circuit microelement and base assembly has a conventional microelement with a body of insulating material and a separate parallel series of terminals all projecting in the same direction. The base of the assembly is of insulating material and has a plurality of recesses each holding a lower portion of a connector engageable with a terminal. The microelement is mounted on a top surface of the base with its terminals entering the recesses and engaging their respective connectors. The connectors have portions projecting upwardly about and above the microelement body for ready engagement and connection with experimental or other wiring. All wiring connections are thus readily effected from one side of the assembly unit without reversal or "flip flopping" of the assembly.