Patents by Inventor Alan P. Webster

Alan P. Webster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered ceramic capacitor with soft leaded module
    Patent number: 10229785
    Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: March 12, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell
  • Coefficient of thermal expansion compensating compliant component
    Patent number: 9357634
    Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: May 31, 2016
    Assignee: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, John Bultitude, Abhijit Gurav
  • High aspect ratio stacked MLCC design
    Patent number: 8988857
    Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: March 24, 2015
    Assignee: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
  • Multi-Layered Ceramic Capacitor with Soft Leaded Module
    Publication number: 20140160624
    Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 12, 2014
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell
  • COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT
    Publication number: 20130284501
    Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
    Type: Application
    Filed: April 25, 2013
    Publication date: October 31, 2013
    Applicant: KEMET Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, John Bultitude, Abhijit Gurav
  • HIGH ASPECT RATIO STACKED MLCC DESIGN
    Publication number: 20130146347
    Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
  • Leaded multi-layer ceramic capacitor with low ESL and low ESR
    Patent number: 8331078
    Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: December 11, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: John E. McConnell, Reggie Phillips, Alan P. Webster, John Bultitude, Mark R. Laps, Lonnie G. Jones, Garry Renner
  • LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR
    Publication number: 20100243307
    Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
    Type: Application
    Filed: March 26, 2010
    Publication date: September 30, 2010
    Inventors: John E. McConnell, Reggie Phillips, Alan P. Webster, John Bultitude, Mark R. Laps, Lonnie G. Jones, Garry Renner