Abstract: An electronic circuit interconnection method and apparatus involves mating a first circuit substrate with a second circuit substrate such that a projection of a circuit component mounted on at least one of the first and second circuit substrates is received in an opening in the other. The opening has a shape complementary to the projection, to register the first and second circuit substrates in a fixed orientation relative to each other in which contacts on the first circuit substrate are aligned and adjacent corresponding contacts on the second circuit substrate. The first and second circuit substrates are then clamped together to press the contacts on each substrate toward each other to place and maintain them in contact with each other.

Abstract: An apparatus including a stand for housing a telephone electronics module and a cover for housing user interface components. There is a mechanical connector on the housing and a complementary mechanical connector on the cover, the mechanical connector and the complementary mechanical connector being engagable to connect the cover to the stand. An electrical connector on the stand is operable to communicate with the telephone electronics module. A complementary electrical connector on the cover is operable to communicate with the interface components. The electrical connector and the complementary electrical connector are placed in communication with each other when the mechanical connector is engaged with the complementary mechanical connector, to provide electrical communication between the telephone electronics module and the interface components.