Abstract: The present invention provides a composition, which comprises an aqueous solvent and forms a transparent colorless coating, which yields markings of high contrast on exposure to energy. It also provides a process for the preparation of these compositions, substrates coated with these compositions and a process for their preparation, a process for preparing marked substrates using these compositions and marked substrates obtainable by the latter process.

Abstract: The present invention provides coating compositions for marking substrates, which comprises a color former, an amine salt of an organic metal compound, a binder, a solvent, and optionally additional components, wherein the amine salt of the organic metal compound is of formula (I) in which X is silicon or boron, and E and F are the same or different and are selected from the group consisting of a, b, c, d, e, f, g, h in which R6 and R7 are the same or different are hydrogen, C1-4-alkyl, C1-4-alkoxy, halogen, amino or carboxy, and for X=silicon o=1 and p=0, and R1 is aryl, aralkyl or C1-4-alkyl, or o=1 and p=1, and R1 and R2 together form a one residue selected from the group consisting of a, b, c, d, e, f, g and h, and for X=boron o=0 and p=0, and R3, R4 and R5 are the same or different and are hydrogen, C1-12-alkyl, C1-6-hydroxyalkyl, allyl, aralkyl or arylsulfonyl, in which aralkyl or arylsulfonyl can be substituted with C1-4-alkyl, or R3 and R4 together with the nitrogen to which they are attached form a m

Abstract: The present invention provides a composition, which comprises a latent activator. It also provides a process for the preparation of these compositions, substrates coated with these compositions and a process for their preparation, a process for preparing marked substrates using these compositions and marked substrates obtainable by the latter process.

Abstract: The present invention provides a composition, which comprises a latent activator. It also provides a process for the preparation of these compositions, substrates coated with these compositions and a process for their preparation, a process for preparing marked substrates using these compositions and marked substrates obtainable by the latter process.

Abstract: The present invention provides a composition, which comprises an aqueous-based solvent and forms a transparent colourless coating, which yields markings of high contrast on exposure to energy. It also provides a process for the preparation of these compositions, substrates coated with these compositions and a process for their preparation, a process for preparing marked substrates using these compositions and marked substrates obtainable by the latter process.

Abstract: The present invention provides coating compositions for marking substrates, which comprises a colour former, an amine salt of an organic metal compound, a binder, a solvent, and optionally additional components, wherein the amine salt of the organic metal compound is of formula (I) in which X is silicon or boron, and E and F are the same or different and are selected from the group consisting of a, b, c, d, e, f, g, h in which R6 and R7 are the same or different are hydrogen, C1-4-alkyl, C1-4-alkoxy, halogen, amino or carboxy, and for X=silicon o=1 and p=0, and R1 is aryl, aralkyl or C1-4-alkyl, or o=1 and p=1, and R1 and R2 together form a one residue selected from the group consisting of a, b, c, d, e, f, g and h, and for X=boron o=0 and p=0, and R3, R4 and R5 are the same or different and are hydrogen, C1-12-alkyl, C1-6-hydroxyalkyl, allyl, aralkyl or arylsulfonyl, in which aralkyl or arylsulfonyl can be substituted with C1-4-alkyl, or R3 and R4 together with the nitrogen to which they are attached form a

Abstract: The invention concerns a lead-through transit for cables 3 or pipes of the kind having a frame 1 of the opening 2 is filled by a series of modular resilient lead-through blocks 4 and blank blocks 5 arranged in rows separated by stayplates 6 with a compression and packer assembly 7 clamping and holding the blocks 4,5 and cables 3 in sealed engagement. The lead-through blocks 4 comprise two complementary half-blocks 40 that provide, when assembled together around a cable, a passageway 41 for the cable. Each half-block 40 has a series of axially spaced semi-annular lands 42 separated by recesses 43. The lands 42 provide axially spaced sealing faces for engagement with the cable while the recesses 43 enable resilient deformation of the block to accommodate variations in cable size. To assist in such resilient conformation of the half-blocks 40, it is preferred that the half-block has recesses 44 formed on the outer faces that are aligned with the lands 42.

Abstract: In a lead-through transit for cables or pipes 3 of the kind in which a series of modular resilient blocks 4 or blanks 5 are mounted in a frame 1 through which the cables 3 extend, the invention is directed to the compression and packer assembly 7 by which the opening through the frame 1 is closed and pressure applied to the assembled cables 3, blocks 4 and blanks 5 with stayplates 6 between each row of blocks. The compression and packer assembly 7 comprises a rigid plate 8 which seats on the assembled blocks 4 and blanks 5 for engagement by a compression bolt 33 mounted on the frame 1 to apply a load to the plate 8.

Abstract: A chip carrying module includes a number of engineering change lines buried below the surface of the module. The engineering change lines are interrupted periodically to provide a set of vias extending up to the upper surface of the module between each set of chips where the vias are connected by dumbbell-shaped pads including a narrow link which permits laser deletion or the like. In addition, the dumbbell-shaped pads are located adjacent to the fan-out pads for the chips. Thus, the fan-out pads can be connected to the dumbbell-shaped pads by means of fly-wires. In addition, individual engineering change lines can be connected together to reach every region of the module by connecting a fly-wire from one dumbbell-shaped pad to another. In addition, by deleting the links at such dumbbell-shaped pads, the engineering change connections are limited to the particular path required.

Abstract: A decoupling capacitor for mounting on an integrated circuit multi-layer ceramic. A bottom layer electrode, is evaporated or sputtered onto a carrier. A high dielectric layer is deposited followed by the upper metallurgy and a top isolating layer. Via holes are etched to respective electrode layers, BLM deposited thereon followed by solder balls. The electrode is mounted onto the substrate, solder balls face down in contact with a compatible footprint.