Abstract: A method of die cutting. The method comprises: providing a cutting die (10); providing a work piece (20) to be cut; providing a first polymer film (30) between the cutting-die (10) and the work piece (20); and pressing the cutting die (10) and the work piece (20) together, with the first polymer film (30) between them, to cut the work piece (20). Also provided is a laminate obtainable by said die cutting method and a kit of parts for use in said die cutting method.

Abstract: A new and distinct kiwifruit variety is disclosed. The variety results from selection among a population of seedlings derived from crossing the kiwifruit selections known as 40-10-14e.92 (not patented, Actinidia deliciosa) and CK71_06 (not patented, Actinidia chinensis). The fruit of the plant of this new kiwifruit variety is characterized by early maturity, green flesh color, and a sweet, tropical/kiwifruit flavor. The new kiwifruit variety has been named ‘ZESH004’.

Abstract: Semiconductor structure having a semiconductor body with a planar surface. At least one region having an impurity therein is formed in the body and extends to the surface. A layer of insulating material is provided on the surface. Openings are formed in the layer of insulating material and expose said surface. The openings are defined by inclined side walls which extend at an angle with respect to said surface of less than 70.degree.. Contact means is carried by the surface and extends through the opening to form contact with the region. At least portions of the contact means have a slope which conforms generally to the slope of the side walls.In the method, two materials are utilized in which one material has an appreciably higher etch rate than the other material so that a slope is provided on the material having the lower etch rate.

Abstract: A new and distinct kiwifruit variety is disclosed. The variety results from selection among a population of seedlings derived from crossing the kiwifruit selections known as 40-10-14e.92 (not patented, Actinidia deliciosa) and CK71_06 (not patented, Actinidia chinensis). The fruit of the plant of this new kiwifruit variety is characterized by early maturity, green flesh color, and a sweet, tropical/kiwifruit flavor. The new kiwifruit variety has been named ‘ZESH004’.