Patents by Inventor Alan T. Radwanski

Alan T. Radwanski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9574064
    Abstract: The invention provides a process for injection blow molding an article, said process comprising injecting into a mold cavity a composition, comprising at least one ethylene-based polymer and less than, or equal to, 1000 ppm of a mold release agent, based on the total weight of the composition. The invention also provides a composition comprising a blend, wherein the blend comprises at least one high molecular weight (HMW) ethylene-based polymer, and at least one low molecular weight (LMW) ethylene-based polymer, and wherein the blend has an unsaturation level, as determined by IR, and expressed as vinyls per 1000 carbon atoms, less than, or equal to, 0.5 vinyls per 1000 carbon atoms, and wherein the high molecular weight (HMW) ethylene-based polymer has a density from 0.925 to 0.950 g/cc.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: February 21, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Mridula Kapur, Alan T. Radwanski
  • Publication number: 20110136983
    Abstract: The invention provides a process for injection blow molding an article, said process comprising injecting into a mold cavity a composition, comprising at least one ethylene-based polymer and less than, or equal to, 1000 ppm of a mold release agent, based on the total weight of the composition. The invention also provides a composition comprising a blend, wherein the blend comprises at least one high molecular weight (HMW) ethylene-based polymer, and at least one low molecular weight (LMW) ethylene-based polymer, and wherein the blend has an unsaturation level, as determined by IR, and expressed as vinyls per 1000 carbon atoms, less than, or equal to, 0.5 vinyls per 1000 carbon atoms, and wherein the high molecular weight (HMW) ethylene-based polymer has a density from 0.925 to 0.950 g/cc.
    Type: Application
    Filed: August 28, 2009
    Publication date: June 9, 2011
    Applicant: Dow Global Technologies LLC
    Inventors: Mridula Kapur, Alan T. Radwanski
  • Patent number: 7786203
    Abstract: A polymer composition comprises a polyolefin and a nucleating or clarifying agent dispersed or dissolved in the polyolefin. Methods for producing the polymer composition and method for producing articles from the polymer composition are also described. Molded polymer articles and polymer film may be manufactured using the compositions of the invention.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: August 31, 2010
    Assignee: Milliken & Company
    Inventors: Rob Hanssen, Michael B. Barker, Nathan A. Mehl, Weihua Sonya Wolters, Sean M. Bernhardt, Alan T. Radwanski