Abstract: In various embodiments, a transparent hinged substrate apparatus integrated into a portable computer may address common deficiencies associated with space limitations on student desktop surfaces. The transparent hinged substrate apparatus may utilize, in some embodiments, a transparent substrate that is positioned between the display side and the keypad side of a portable computer. The transparent hinged substrate apparatus may be movable into multiple positions including one position that covers the keypad side of the portable computer without touching any of the keys of the keypad. Thus, the keypad surface may now be used as a work surface using the same physical space occupied by the portable computer.

Abstract: In various embodiments, a transparent hinged substrate apparatus integrated nto a portable computer may address common deficiencies associated with space limitations on student desktop surfaces. The transparent hinged substrate apparatus may utilize, in some embodiments, a transparent substrate that is positioned between the display side and the keypad side of a portable computer. The transparent hinged substrate apparatus may be movable into multiple positions including one position that covers the keypad side of the portable computer without touching any of the keys of the keypad. Thus, the keypad surface may now be used as a work surface using the same physical space occupied by the portable computer.

Abstract: An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.

Abstract: An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end.

Abstract: In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling for the first processor. A second processor may be installed on the system board and a second liquid cooling system may be configured to provide dedicated cooling for the second processor. In some examples, a liquid cooling system includes a tank, a first heat exchanger attached to a first side of the tank, and a second heat exchanger attached to a second side of the tank opposite to the first side of the tank. Other embodiments are disclosed and claimed.

Abstract: Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.