Abstract: Modular socket technology is disclosed, which includes a contact board mounted to an electronic device for receiving voltage and current signals to be transmitted from the electronic device to a semiconductor circuit. A compression coupler is provided for receiving the semiconductor circuit. The compression coupler includes a printed circuit board having a plurality of conductors mounted to a first side thereof, and extending to a second side thereof for providing electrical contact between the leads of the semiconductor circuit and the contact board. The contact board further includes a resilient conductor adapted to mechanically and electrically engage the plurality of conductors of the compression coupler, thereby to couple voltage and current signals from the electronic device to the semiconductor circuit. The modular socket apparatus may further include a semiconductor carrier for receiving the semiconductor circuit.