Patents by Inventor Alan Weir Bucher

Alan Weir Bucher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230396023
    Abstract: A receptacle assembly includes a receptacle cage including cage walls forming a cavity. The cage walls include a top wall, a first side wall, and a second side wall. The receptacle cage extending between a front and a rear. The cavity includes a module channel configured to receive a pluggable module. The receptacle assembly includes a thermal transport assembly coupled to the receptacle cage. The thermal transport assembly includes a thermal bridge is received in the cavity. The thermal bridge includes a thermal interface at a bottom of the thermal bridge configured to interface with the pluggable module and remove heat from the pluggable module. The thermal bridge includes an orientation tab extending from the bottom. The orientation tab defines a keying feature for keyed mating with the pluggable module to orient the pluggable module in the module channel.
    Type: Application
    Filed: June 3, 2022
    Publication date: December 7, 2023
    Inventors: Alan Weir Bucher, Nitish Balakrishnan
  • Publication number: 20230378686
    Abstract: A receptacle assembly includes a receptacle cage having a channel separator received in the cavity between the side walls separating the cavity into upper and lower module channels receiving corresponding pluggable modules. The receptable assembly includes a thermal transport assembly coupled to the receptacle cage having an upper cooling module, a lower cooling module and a cold plate at the rear of the receptacle cage. The upper cooling module is located in a top opening of the cage to thermally couple to the upper pluggable module. The lower cooling module is loaded into the separator chamber to thermally coupled to the lower pluggable module plugged into the lower module chamber.
    Type: Application
    Filed: June 14, 2022
    Publication date: November 23, 2023
    Inventors: Alan Weir Bucher, WenYu Liu
  • Patent number: 11778786
    Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: October 3, 2023
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Alan Weir Bucher
  • Publication number: 20230200020
    Abstract: A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 22, 2023
    Inventor: Alan Weir Bucher
  • Patent number: 11439042
    Abstract: A heat exchange assembly includes a thermal bridge including upper and lower bridge elements including upper and lower plates arranged in plate stacks. The lower plates include lower fin plates and lower spacer plates with lower ends configured to be mechanically and thermally coupled to the electrical component. The upper plates include upper fin plates and upper spacer plates with upper ends configured to be mechanically and thermally coupled to a heat exchanger. The upper and lower fin plates are interleaved. The heat exchange assembly includes installation spring elements coupled between the upper and lower plates and biased against the upper and lower plates during installation. The installation spring elements are removable after the upper and lower plates are coupled to the electrical component and the heat exchanger to remove the biasing force between the upper and lower plates.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: September 6, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Alan Weir Bucher
  • Patent number: 11291140
    Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 29, 2022
    Assignee: TEC CONNECTIVITY SERVICES GmbH
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Patent number: 11240934
    Abstract: A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: February 1, 2022
    Assignee: TE CONNECTIVITY SERVICES GmbH
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Publication number: 20220030739
    Abstract: A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 27, 2022
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Publication number: 20220015267
    Abstract: A heat sink assembly includes a plate stack including fin plates and spacer plates with bottom edges forming a compliant thermal interface configured to interface with an electrical component. Upper edges of the fin plates are located above the spacer plates to form airflow channels between the fin plates. The heat sink assembly includes a support frame supporting the fin plates and the spacer plates in the plate stack. The support frame includes a spring support member engaging a spring element to locate the spring element relative to the support frame. The spring element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component to press the bottom edges of the fin plates and the spacer plates against the electrical component.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 13, 2022
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Patent number: 10993352
    Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: April 27, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 10965067
    Abstract: Plug assembly including a pluggable connector having a mating end and a trailing end and a central axis extending therebetween. The pluggable connector includes internal electronics that generate thermal energy within the pluggable connector. The mating end is configured to engage a data connector. The pluggable connector also includes a thermal interface region that is coupled to the pluggable connector. The thermal interface region includes a series of transfer plates that extend parallel to each other and to the central axis. The transfer plates define a series of plate-receiving slots extending parallel to the central axis. The thermal interface region transfers the thermal energy generated by the internal electronics through the transfer plates.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: March 30, 2021
    Assignee: TE CONNECTIVITY SERVICES GmbH
    Inventor: Alan Weir Bucher
  • Publication number: 20210084791
    Abstract: A heat exchange assembly includes a thermal bridge including upper and lower bridge elements including upper and lower plates arranged in plate stacks. The lower plates include lower fin plates and lower spacer plates with lower ends configured to be mechanically and thermally coupled to the electrical component. The upper plates include upper fin plates and upper spacer plates with upper ends configured to be mechanically and thermally coupled to a heat exchanger. The upper and lower fin plates are interleaved. The heat exchange assembly includes installation spring elements coupled between the upper and lower plates and biased against the upper and lower plates during installation. The installation spring elements are removable after the upper and lower plates are coupled to the electrical component and the heat exchanger to remove the biasing force between the upper and lower plates.
    Type: Application
    Filed: August 11, 2020
    Publication date: March 18, 2021
    Inventor: Alan Weir Bucher
  • Publication number: 20200373706
    Abstract: A heat sink assembly includes an upper heat sink element having upper plates each having sides between front and rear ends and each having inner and outer ends and a lower heat sink element having lower plates each having sides between front and rear ends and each having inner and outer ends. The lower plates include lower spacer plates and lower interface plates with the outer ends thereof thermally coupled to an electronic module. The lower interface plates include interface fins interfacing with the upper plates. The heat sink assembly includes a spring element having an upper spring member engaging the inner ends of the upper plates to bias the upper plates in a first biasing direction away from the lower plates and having a lower spring member engaging the inner ends of the lower plates to bias the lower plates in a second biasing direction away from the upper plates.
    Type: Application
    Filed: April 23, 2020
    Publication date: November 26, 2020
    Inventors: Alan Weir Bucher, Leo Joseph Graham
  • Publication number: 20200221607
    Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.
    Type: Application
    Filed: January 8, 2019
    Publication date: July 9, 2020
    Inventor: Alan Weir Bucher
  • Patent number: 10575442
    Abstract: A heat sink assembly for a pluggable module having a housing includes a plurality of discrete heat sink members in thermal communication with more than one wall of the housing. The heat sink members transfer heat from the pluggable module to the surrounding environment. The heat sink assembly also includes a spring member configured to exert a force on the plurality of discrete heat sink members for forcing the heat sink members into thermal engagement with the housing.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: February 25, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Publication number: 20200015385
    Abstract: A heat sink assembly for a pluggable module having a housing includes a plurality of discrete heat sink members in thermal communication with more than one wall of the housing. The heat sink members transfer heat from the pluggable module to the surrounding environment. The heat sink assembly also includes a spring member configured to exert a force on the plurality of discrete heat sink members for forcing the heat sink members into thermal engagement with the housing.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 9, 2020
    Inventor: Alan Weir Bucher
  • Patent number: 10020614
    Abstract: A pluggable module includes a pluggable body having a top wall, a bottom wall and side walls therebetween. The pluggable body defines a chamber extending along a longitudinal axis between a cable end and a mating end opposite the cable end. The pluggable module includes a latch held by the pluggable body. The latch has an actuation end and a latching end opposite the actuation end. The actuation end has a handle and the latching end has a latching tooth configured to latchably secure the pluggable module to a component when the latching tooth is in a latching position. The actuation end is movable in a linear actuation direction to move the latching tooth in a linear releasing direction perpendicular to the actuation direction from the latching position to a released position.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: July 10, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Publication number: 20180159279
    Abstract: Plug assembly including a pluggable connector having a mating end and a trailing end and a central axis extending therebetween. The pluggable connector includes internal electronics that generate thermal energy within the pluggable connector. The mating end is configured to engage a data connector. The pluggable connector also includes a thermal interface region that is coupled to the pluggable connector. The thermal interface region includes a series of transfer plates that extend parallel to each other and to the central axis. The transfer plates define a series of plate-receiving slots extending parallel to the central axis. The thermal interface region transfers the thermal energy generated by the internal electronics through the transfer plates.
    Type: Application
    Filed: February 5, 2018
    Publication date: June 7, 2018
    Inventor: Alan Weir Bucher
  • Patent number: 9958497
    Abstract: A testing pluggable module includes a pluggable body extending between a front end and a mating end defining a mating interface with a communication connector of a receptacle assembly. The mating end is receivable in a module cavity of the receptacle assembly to mate with the communication connector. The pluggable body has an exterior forward of the mating end. The testing pluggable module includes an internal circuit board held in the pluggable body having a testing circuit operating at least one testing function. The testing pluggable module includes a user interface on the exterior of the pluggable body. The user interface has an input configured to operably control the at least one testing function of the testing circuit.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: May 1, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Alex Michael Sharf, Alan Weir Bucher
  • Patent number: 9924615
    Abstract: A receptacle assembly includes a receptacle housing having a module cavity defined by a top wall having a plurality of apertures therethrough. The module cavity has a port at a front end of the receptacle housing configured to receive a pluggable module. A communication connector is positioned in the receptacle housing having a mating interface for mating with the pluggable module. A heat exchanger is received in the module cavity having a heat spreader positioned interior of the module cavity below the top wall. The heat spreader is configured to be in thermal communication with the pluggable module. The heat exchanger has a plurality of fin segments extending from the heat spreader. The fin segments are received in corresponding apertures in the top wall to pass through the top wall to an exterior of the module cavity for heat dissipation.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: March 20, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher