Patents by Inventor Alan Yee

Alan Yee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7620754
    Abstract: A carrier module is physically compatible with a XENPAK/X2 10 GE slot and includes a socket for accepting a non-XENPAK/X2 module and interface circuitry for providing appropriate signals to a XENPAK/X2 70-pin connector on an interior side of the carrier module. The carrier module includes a cookie, accessible by host software, identifying the type of carrier module and non-XENPAK/X2 module accepted by the carrier card.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: November 17, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Alan Yee, Eric Wiles, James P. Rivers, Sandeep Arvind Patel, William F. Edwards, Jr., Jeffrey Provost
  • Patent number: 7433193
    Abstract: An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a transceiver module space. The rail further includes a blocking structure coupled to the component. The blocking structure is adapted to (i) permit a connecting portion of a transceiver module to connect with a connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a circuit board side of the transceiver module faces the printed circuit board, and (ii) prevent the transceiver module from contacting the connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a heat dissipation side of the transceiver module faces the printed circuit board.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 7, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Alan Yee, Eric Wiles, Samir Vasavda
  • Publication number: 20070118821
    Abstract: A system includes a Scalable Vector Graphics (SVG) image for representing at least one portion of a consumer electronic device and a scaler for scaling the SVG image to obtain a scaled SVG image where a display size of the scaled SVG image equals a predefined physical size of the at least one portion of the consumer electronic device where the SVG image is defined by an SVG tag.
    Type: Application
    Filed: November 18, 2005
    Publication date: May 24, 2007
    Applicant: Sun Microsystems, Inc.
    Inventors: Alan Yee, Timothy Dunn
  • Publication number: 20060256521
    Abstract: An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a transceiver module space. The rail further includes a blocking structure coupled to the component. The blocking structure is adapted to (i) permit a connecting portion of a transceiver module to connect with a connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a circuit board side of the transceiver module faces the printed circuit board, and (ii) prevent the transceiver module from contacting the connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a heat dissipation side of the transceiver module faces the printed circuit board.
    Type: Application
    Filed: May 11, 2005
    Publication date: November 16, 2006
    Inventors: Alan Yee, Eric Wiles, Samir Vasavda
  • Publication number: 20060216958
    Abstract: A carrier module is physically compatible with a XENPAK/X2 10 GE slot and includes a socket for accepting a non-XENPAK/X2 module and interface circuitry for providing appropriate signals to a XENPAK/X2 70-pin connector on an interior side of the carrier module. The carrier module includes a cookie, accessible by host software, identifying the type of carrier module and non-XENPAK/X2 module accepted by the carrier card.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Inventors: Alan Yee, Eric Wiles, James Rivers, Sandeep Patel, William Edwards, Jeffrey Provost