Patents by Inventor Alasdair Dent

Alasdair Dent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160358808
    Abstract: In one aspect, several apparatuses are described that allow a processing chamber designed for plasma-enhanced chemical vapor deposition on 300 mm wafers to be performed on 200 mm wafers. More specifically, a modified pedestal, carrier plate, and showerhead are described that have been designed for 200 mm wafers and are compatible with 300 mm wafer processing chambers. It has further been observed that deposited films using the modified 200 mm apparatuses are comparable in quality with films deposited with the 300 mm devices they replace.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 8, 2016
    Inventors: Eric Russell Madsen, Narudha Tai Ben-Yuhmin, Michael Christensen, Chris Erick Karlsrud, Joseph Hung-chi Wei, Linh Hoang, Alasdair Dent
  • Patent number: 8968503
    Abstract: Novel methods for extending electrostatic chuck lifetimes are provided. The methods involve providing a chuck having a metal cooling plate attached to a ceramic top plate, and after a period of use, disassembling the chuck, and providing a new chuck including the used metal cooling plate. In certain embodiments, the use of a low temperature bond material uniquely allows the described disassembly and reassembly without damage to other parts of the chuck.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: March 3, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Alisa Hart, John C. Boyd, Liza Palma, Alasdair Dent
  • Publication number: 20140124123
    Abstract: Novel methods for extending electrostatic chuck lifetimes are provided. The methods involve providing a chuck having a metal cooling plate attached to a ceramic top plate, and after a period of use, disassembling the chuck, and providing a new chuck including the used metal cooling plate. In certain embodiments, the use of a low temperature bond material uniquely allows the described disassembly and reassembly without damage to other parts of the chuck.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 8, 2014
    Applicant: Novellus Systems, Inc.
    Inventors: Alisa Hart, John C. Boyd, Liza Palma, Alasdair Dent
  • Patent number: 8597448
    Abstract: Novel methods for extending electrostatic chuck lifetimes are provided. The methods involve providing a chuck having a metal cooling plate attached to a ceramic top plate via indium bonding, and after a period of use, disassembling the chuck, and providing a new chuck including the used metal cooling plate. In certain embodiments, the use of indium as a bond material uniquely allows the described disassembly and reassembly without damage to other parts of the chuck.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: December 3, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Alisa Hart, John C. Boyd, Liza Palma, Alasdair Dent
  • Publication number: 20110155299
    Abstract: Novel methods for extending electrostatic chuck lifetimes are provided. The methods involve providing a chuck having a metal cooling plate attached to a ceramic top plate via indium bonding, and after a period of use, disassembling the chuck, and providing a new chuck including the used metal cooling plate. In certain embodiments, the use of indium as a bond material uniquely allows the described disassembly and reassembly without damage to other parts of the chuck.
    Type: Application
    Filed: December 29, 2009
    Publication date: June 30, 2011
    Inventors: Alisa Hart, John C. Boyd, Liza Palma, Alasdair Dent