Patents by Inventor Albert A. Onderick, II

Albert A. Onderick, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Segmented via for vertical PCB interconnect
    Patent number: 10420213
    Abstract: Printed circuit boards having an increased density of vertical interconnect paths, as well as methods for their manufacture. One example may provide a printed circuit board having an increased density of vertical interconnect paths by forming a plurality of segmented vias. The segmented vias may extend through interior layers of the printed circuit board. The segmented vias may be formed of portions of vias in the interior layers of the printed circuit board. An area between three or more segmented vias may be filled with resin or other material or materials.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 17, 2019
    Assignee: Apple Inc.
    Inventors: Mark J. Beesley, Albert A. Onderick, II, Anne M. Mason, Craig A. Gammel, Shawn X. Arnold
  • SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT
    Publication number: 20190075653
    Abstract: Printed circuit boards having an increased density of vertical interconnect paths, as well as methods for their manufacture. One example may provide a printed circuit board having an increased density of vertical interconnect paths by forming a plurality of segmented vias. The segmented vias may extend through interior layers of the printed circuit board. The segmented vias may be formed of portions of vias in the interior layers of the printed circuit board. An area between three or more segmented vias may be filled with resin or other material or materials.
    Type: Application
    Filed: September 5, 2017
    Publication date: March 7, 2019
    Applicant: Apple Inc.
    Inventors: Mark J. Beesley, Albert A. Onderick, II, Anne M. Mason, Craig A. Gammel, Shawn X. Arnold