Patents by Inventor Albert A Yeh

Albert A Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6840428
    Abstract: A self-adhesive flexible circuit for printed circuit assembly repair is provided. The flexible circuit comprises a carrier film, a circuit trace and an adhesive. The flexible circuit is placeable on a printed circuit board having a circuit assembly and allows simple repair of boards not designed or manufactured correctly and which contain undesirable short or open circuits or misrouted traces. The flexible circuit allows for placement in a desired location, adherence to the circuit board using its own adhesive. The flexible circuit can then be electrically attached, i.e. solder or conductively adhered, to the board.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: January 11, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Marvin G Wong, Albert A Yeh, Barry Welsh
  • Publication number: 20030121953
    Abstract: A self-adhesive flexible circuit for printed circuit assembly repair is provided. The flexible circuit comprises a carrier film, a circuit trace and an adhesive. The flexible circuit is placeable on a printed circuit board having a circuit assembly and allows simple repair of boards not designed or manufactured correctly and which contain undesirable short or open circuits or misrouted traces. The flexible circuit allows for placement in a desired location, adherence to the circuit board using its own adhesive. The flexible circuit can then be electrically attached, i.e. solder or conductively adhered, to the board.
    Type: Application
    Filed: February 19, 2003
    Publication date: July 3, 2003
    Inventors: Marvin G. Wong, Albert A. Yeh, Barry Welsh
  • Publication number: 20030042295
    Abstract: A self-adhesive flexible circuit for printed circuit assembly repair is provided. The flexible circuit comprises a carrier film, a circuit trace and an adhesive. The flexible circuit is placeable on a printed circuit board having a circuit assembly and allows simple repair of boards not designed or manufactured correctly and which contain undesirable short or open circuits or misrouted traces. The flexible circuit allows for placement in a desired location, adherence to the circuit board using its own adhesive. The flexible circuit can then be electrically attached, i.e. solder or conductively adhered, to the board.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventors: Marvin G. Wong, Albert A. Yeh, Barry Welsh
  • Patent number: 5641995
    Abstract: A leadless chip carrier is attached to a printed circuit board by soldering its input-output connections to the printed circuit board and also by providing an adhesive between a central portion of the leadless chip carrier and the printed circuit board. This adhesive provides increased mechanical strength to the connection, improving its tolerance to temperature cycling. The adhesive used may be the same solder used to make the input-output connections.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: June 24, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Katrina Sloma, Martin L. Guth, Albert A. Yeh