Patents by Inventor Albert Alcorn

Albert Alcorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High speed wafer sort and final test
    Patent number: 6777971
    Abstract: A semiconductor device which receives and transmits data at high speed is tested at operational speed at wafer sort. A probe card includes a high-speed interconnect that couples probe output bonding pads to probe input bonding pads. The high-speed interconnect connects a respective output of a transmitter in the die to a respective input of a receiver in the die while the probe card is connected to the die. A built in self test circuit in the die generates test patterns and compares them for accuracy. The test patterns are routed on the high-speed interconnect from the output of the transmitter to the input of the receiver allowing the data path through the receiver and transmitter in the die to be tested at operational speed before the die is assembled into a package.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: August 17, 2004
    Assignee: LSI Logic Corporation
    Inventors: Mohan Kirloskar, Albert Alcorn
  • High speed wafer sort and final test
    Publication number: 20030214317
    Abstract: A semiconductor device which receives and transmits data at high speed is tested at operational speed at wafer sort. A probe card includes a high-speed interconnect that couples probe output bonding pads to probe input bonding pads. The high-speed interconnect connects a respective output of a transmitter in the die to a respective input of a receiver in the die while the probe card is connected to the die. A built in self test circuit in the die generates test patterns and compares them for accuracy. The test patterns are routed on the high-speed interconnect from the output of the transmitter to the input of the receiver allowing the data path through the receiver and transmitter in the die to be tested at operational speed before the die is assembled into a package.
    Type: Application
    Filed: March 20, 2003
    Publication date: November 20, 2003
    Applicant: Velio Communications, Inc.
    Inventors: Mohan Kirloskar, Albert Alcorn