Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Abstract: In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Abstract: A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper surface of the carrier substrate. A solder bump is deposited on at least one of the pads to be connected, the component is alignedly mated with the carrier substrate, and the at least one solder bump is soldered in order to wet the contact surfaces. It is provided that during the soldering, the at least one solder bump is deformed within the contacting plane in such a way as to achieve a degree of deformation that permits the two-dimensional analysis of said degree of deformation by a radiograph of the interconnection site.

Abstract: An easily producible and easily installable ignition mechanism for restraint devices in a vehicle includes an ignition capsule, in which at least one ignition element and its contact pins are fixed. Into the ignition capsule a pedestal can be set, in which a carrier arrangement having circuit elements is arranged. Spring elements are present, by which contact is established between circuit elements and contact pins of the ignition element when the pedestal is set into the ignition capsule.

Abstract: An electrical circuit on a substrate (10), having at least one component (30, 40) attached to a conductor layer (20, 21, 22, 23, 24, 25), is proposed; the component is surrounded by depressions (50, 51, 60) in the conductor layer. In addition, a substrate having at least one conductor layer for attaching at least one electrical component is proposed, the conductor layer having depressions to provide a flow barrier for a connecting material which is used for attaching the component; the depressions surround an area for attaching the component, and are positioned at a distance from each other such that the component has room between them, without the depressions having to be covered by the component.

Abstract: The invention relates to a substrate board (2) for micro hybrid integrated circuits (7) having a ceramic body (3). According to the present invention, provision is made that the ceramic body (3) is a porous body, whose cavities are filled with aluminum. Due to the relatively small difference in thermal expansion coefficients of the substrate board (2) and the micro hybrid integrated circuit (7), a very good thermal bond of the micro hybrid integrated circuits (7) to the substrate board (2) is possible.

Abstract: An acceleration sensor having a piezoelectric sensor element, which is supported as a flexural resonator in a holding module and whose electrodes are connected to an evaluation circuit. The holding module mechanically fixes the sensor element in position and provides, at the same time, for its electrical contacting.