Abstract: The present invention relates to the improved processing of materials wherein microcapsules containing a microencapsulated detection agent are combined with the components to be mixed; the microcapsules are designed to rupture at predetermined conditions, and the mixtures are monitored for the presence of the detection agent which indicates that the predetermined conditions were achieved.

Abstract: This invention relates to coating compositions containing a wax, an acid component and a polyvinyl alkyl ether having a molecular weight in the range of from 1,000 to 15,000. Most preferably, the polyvinyl alkyl ether is either polyvinyl methyl ether or polyvinyl isobutyl ether. The coatings made from these compositions have highly improved adhesive properties toward the substrate upon which they are deposited. This is true over a wide range of temperatures and especially in the very low temperature range. They can be utilized as hot melt coatings for items such as paperboard and corrugated board. They are especially effective as coatings for polymeric foams, particularly polyurethane foams.

Abstract: An insulating and protective structure for frozen substrates wherein a hydrophobic or water impermeable base layer is applied first to the substrate and successive layers of a polyurethane foam or similar synthetic plastic foam material are foamed in place on the base layer, each of said foam layers having a vapor penetration-resistant layer on its upper surface and below the next layer of foam. Finally, there is applied a hydrophobic or water impermeable layer to the upper surface of the uppermost vapor penetration-resistant layer.This structure is designed particularly for application to substrates underlain with permafrost in the Arctic and sub-Arctic regions. It is designed to provide moisture penetration resistance, low thermal conductivity and to have both high compressive and flexure strength in order to impede heat transfer even with consequent freeze-thawing of the frozen substrate and likewise prevent physical damage to the surface of the substrate.