Patents by Inventor Albert E. Nagy

Albert E. Nagy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5840170
    Abstract: The invention relates to a process for electrolytic treatment of copper foil, comprising the steps of: (A) applying a voltage across an anode and cathode, wherein the anode and cathode are in contact with an electroplating composition containing a gelatin component; (B) removing organic particulate matter by contacting the electroplating solution containing the organic particulate matter with an adsorbent polymer; and (C) electrolytically treating the copper foil. The electroplating composition can additionally contain an active sulfur-containing component, such as thiourea.
    Type: Grant
    Filed: November 30, 1992
    Date of Patent: November 24, 1998
    Assignee: Gould Electronics Inc.
    Inventor: Albert E. Nagy
  • Patent number: 5322975
    Abstract: An easily peelable or chemically strippable laminate and method of making same comprising an aluminum carrier, an aluminum oxide layer, which is at least 800 Angstroms thick and deposited on the aluminum carrier, copper foil electrodeposited on the aluminum oxide layer and optionally, a brass layer electrodeposited on the copper foil have been discovered. Such laminates find utility in the electronics industry in the fabrication of printed circuit boards and afford an ease of strippability of the protective aluminum carrier-aluminum oxide layer heretofore unknown in the industry. The protective aluminum carrier-aluminum oxide layer of the laminates of the present invention may also be chemically etched away providing a universal carrier for copper foil.
    Type: Grant
    Filed: September 18, 1992
    Date of Patent: June 21, 1994
    Assignee: Gould Electronics Inc.
    Inventors: Albert E. Nagy, Thomas J. Ameen, Peter Peckham
  • Patent number: 4293617
    Abstract: A process is provided for producing a composite structure suitable for use in connection with the manufacture of printed circuits which includes a carrier layer of aluminum and a covering layer of copper which structure is characterized by the fact that the copper layer is tenaciously bonded to the carrier layer but readily separable therefrom by mechanical means without destroying the integrity of the copper layer which process comprises the steps of (a) providing a layer of aluminum foil, (b) cleaning at least one major surface of the aluminum foil to remove surface contaminants therefrom, (c) positioning the aluminum foil in a suitable electrolyte and passing electric current therethrough in such a manner that the foil is rendered cathodic to activate the surface of the foil, (d) positioning the activated foil in a suitable electrolyte and passing electrical current therethrough in such a manner that the foil is rendered anodic and a layer of aluminum oxide is formed on the surface thereof, and (e) electro
    Type: Grant
    Filed: December 26, 1979
    Date of Patent: October 6, 1981
    Assignee: Gould Inc.
    Inventor: Albert E. Nagy