Abstract: A method for packing a semiconductor device 301 in a carrier tape 406 without damage to the leads 302 includes an interlocking mechanism between the molded semiconductor device with indentations 305 formed into the package body, and the carrier tape having mating protrusions 407 slightly smaller than the indentations which cause the device to be held securely without significant movement after a cover tape 409 is adhered to the carrier tape. The features of correctly sized pockets and pedestals, the cover tape, and the interlocking device indentations and tape protrusions prevent damage to the device leads as a result of impact.