Patents by Inventor Albert Hua
Albert Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9036009Abstract: An image compensation device is disclosed. The image compensation image compensation device comprises a 3D band pass filter, a 3D notch filter, a 3D notch mixing unit, a 3D summing unit, a non-3D notch filter, a non-3D band pass filter, a non-3D notch mixing unit, a non-3D band pass mixing unit, and a non-3D summing unit. The 3D notch mixing unit is used for compensating an output of the 3D notch filter. The non-3D notch mixing unit is used for compensating an output of the non-3D notch filter. The non-3D band pass mixing unit is used for compensating an output of the non-3D band pass filter. The image compensation device of the present invention is capable of avoiding the unstable and sparkle-like situation in the prior arts.Type: GrantFiled: March 8, 2013Date of Patent: May 19, 2015Assignee: SILICON INTEGRATED SYSTEMS CORP.Inventors: Albert Hua Tai, Heng-Yi Liu
-
Publication number: 20140253680Abstract: An image compensation device is disclosed. The image compensation image compensation device comprises a 3D band pass filter, a 3D notch filter, a 3D notch mixing unit, a 3D summing unit, a non-3D notch filter, a non-3D band pass filter, a non-3D notch mixing unit, a non-3D band pass mixing unit, and a non-3D summing unit. The 3D notch mixing unit is used for compensating an output of the 3D notch filter. The non-3D notch mixing unit is used for compensating an output of the non-3D notch filter. The non-3D band pass mixing unit is used for compensating an output of the non-3D band pass filter. The image compensation device of the present invention is capable of avoiding the unstable and sparkle-like situation in the prior arts.Type: ApplicationFiled: March 8, 2013Publication date: September 11, 2014Applicant: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Heng-Yi Liu
-
Patent number: 8760580Abstract: An image sharpness device and a method for the same are disclosed. The image sharpness device includes a DC removal unit, at least one filter, at least one noise estimation unit, at least one soft threshold processing unit, and a summing unit. The DC removal unit receives a luminance signal of a field of a frame and removes a DC component of the luminance signal. The filter passes a component of an output of the DC removal unit within a predetermined frequency band. The noise estimation unit estimates a noise value of the field. The soft threshold processing unit forms a sharpness signal according to the noise value. The summing unit sums the luminance signal and the sharpness signal to output a resultant luminance signal. The present invention is capable of avoiding the problem that a noise in the luminance signal is enhanced.Type: GrantFiled: June 19, 2012Date of Patent: June 24, 2014Assignee: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Heng-Yi Liu, Feng-Chi Wei
-
Publication number: 20130335633Abstract: An image sharpness device and a method for the same are disclosed. The image sharpness device includes a DC removal unit, at least one filter, at least one noise estimation unit, at least one soft threshold processing unit, and a summing unit. The DC removal unit receives a luminance signal of a field of a frame and removes a DC component of the luminance signal. The filter passes a component of an output of the DC removal unit within a predetermined frequency band. The noise estimation unit estimates a noise value of the field. The soft threshold processing unit forms a sharpness signal according to the noise value. The summing unit sums the luminance signal and the sharpness signal to output a resultant luminance signal. The present invention is capable of avoiding the problem that a noise in the luminance signal is enhanced.Type: ApplicationFiled: June 19, 2012Publication date: December 19, 2013Applicant: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Heng-Yi Liu, Feng-Chi Wei
-
Publication number: 20130335634Abstract: A noise reduction device and a noise reduction method are disclosed. The noise reduction device includes a DC removal unit for removing a DC component of a luminance; a first wavelet transform unit for performing a wavelet transform on an output of the DC removal unit for outputting a first low and high band signals; a first low and high band noise estimation units for estimating a first low and high band noise values; a first low and high band soft threshold processing units for forming a first low and high band noise reduction signals according to the first low and high band noise values; and a first inverse wavelet transform unit for performing an inverse wavelet transform on the first low and high band noise reduction signals. The present invention is capable of reducing or removing a noise in the luminance signal.Type: ApplicationFiled: June 19, 2012Publication date: December 19, 2013Applicant: Silicon Integrated Systems Corp.Inventor: Albert Hua Tai
-
Publication number: 20130135432Abstract: A device for outputting a chrominance signal and a method thereof are disclosed. The device includes a motion detection unit, a frame edge detection unit, and an output unit. The motion detection unit judges a motion degree of a frame. The frame edge detection unit judges whether a non-3D luminance signal is extracted from an edge of the frame. The output unit outputs one of a 3D chrominance signal and a non-3D chrominance signal as a resultant chrominance signal according to the motion degree which is judged by the motion detection unit and the judgment result of the frame edge detection unit. The present invention is capable of appropriately selecting the 3D chrominance signal and the non-3D chrominance signal when the frame is in the motion condition.Type: ApplicationFiled: November 30, 2011Publication date: May 30, 2013Applicant: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Feng Chi Wei, Heng Yi Liu
-
Publication number: 20130113998Abstract: A device for outputting a luminance signal is disclosed. The device includes a chrominance judgment unit, a field observation unit, and an output unit. The chrominance judgment unit and the field observation unit are used to determine whether a 3D luminance signal is affected. The output unit outputs a resultant luminance signal according to the determination results of the chrominance judgment unit and the field observation unit. According to the present invention, the resultant luminance signal can be accurately obtained by judging characteristics of the 3D luminance signal and a 3D chrominance signal even if a 3D comb filter is wrongly used in a motion condition.Type: ApplicationFiled: November 4, 2011Publication date: May 9, 2013Applicant: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Feng Chi Wei, Heng Yi Liu
-
Patent number: 8421926Abstract: A device for outputting a luminance signal is disclosed. The device includes a chrominance judgment unit, a field observation unit, and an output unit. The chrominance judgment unit and the field observation unit are used to determine whether a 3D luminance signal is affected. The output unit outputs a resultant luminance signal according to the determination results of the chrominance judgment unit and the field observation unit. According to the present invention, the resultant luminance signal can be accurately obtained by judging characteristics of the 3D luminance signal and a 3D chrominance signal even if a 3D comb filter is wrongly used in a motion condition.Type: GrantFiled: November 4, 2011Date of Patent: April 16, 2013Assignee: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Feng Chi Wei, Heng Yi Liu
-
Patent number: 8411207Abstract: A device for outputting a luminance signal and a method thereof are disclosed. The device includes an image smoothing unit, a band pass filter unit, and a summing unit. The image smoothing unit receives a 2D luminance signal and decreases a signal intensity of a component of the 2D luminance signal within a frequency range with respect to a carrier frequency of a chrominance component. The band pass filter unit passes the component of the 2D luminance signal within the frequency range with respect to the carrier frequency. The summing unit sums the output of the image smoothing unit and the output of the band pass filter unit to generate a resultant luminance signal. The present invention is capable of avoiding the occurrence of saw-tooth or sparkling situation caused by inharmonious switching between a 1D comb filter and a 2D comb filter.Type: GrantFiled: December 28, 2011Date of Patent: April 2, 2013Assignee: Silicon Integrated Systems Corp.Inventors: Albert Hua Tai, Feng Chi Wei, Heng Yi Liu
-
Publication number: 20110309365Abstract: A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.Type: ApplicationFiled: August 26, 2011Publication date: December 22, 2011Inventors: Ping Mei, Hao Luo, Albert Hua Jeans, Angeles Marcia Almanza-Workman, Robert A. Garcia, Warren Jackson, Carl P. Taussig, Craig M. Perlov
-
Patent number: 8021935Abstract: A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.Type: GrantFiled: October 1, 2008Date of Patent: September 20, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ping Mei, Hao Luo, Albert Hua Jeans, Angeles Marcia Almanza-Workman, Robert A. Garcia, Warren Jackson, Carl P. Taussig, Craig M. Perlov
-
Patent number: 7706145Abstract: An assembly device for a computer case and outer cover incorporating: a host case provided with a bottom plate and perpendicular left and right side walls, a circuit motherboard fixed within the holding space, a jack panel of relatively small area and size is located at a tail end of the circuit motherboard, and an electrical circuit is printed on an inverse side of the jack panel; a rectangular outer cover, the outer cover can be assembled/disassembled to/from the rectangular gap of the host case, and the jack panel can be plugged into or withdrawn from the socket, thereby realizing a rapid and convenient method of assembling and disassembling the outer cover to and from the host case.Type: GrantFiled: April 10, 2006Date of Patent: April 27, 2010Assignee: Super Micro Computer, Inc.Inventors: Richard Chen, Albert Hua
-
Publication number: 20100078640Abstract: A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.Type: ApplicationFiled: October 1, 2008Publication date: April 1, 2010Inventors: Ping Mei, Hao Luo, Albert Hua Jeans, Angeles Marcia Almanza-Workman, Robert A. Garcia, Warren Jackson, Carl P. Taussig, Craig M. Perlov
-
Patent number: 7541227Abstract: Thin film devices and methods for forming the same are disclosed herein. A method for forming a thin film device includes forming a first at least semi-conductive strip located at a first height relative to a surface of a substrate, and forming a second at least semi-conductive strip adjacent to the first at least semi-conductive strip. The second strip is located at a second height relative to the substrate surface, and the second height is different than the first height. A nano-gap is formed between the first and second at least semi-conductive strips.Type: GrantFiled: October 30, 2006Date of Patent: June 2, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ping Mei, Craig M. Perlov, Albert Hua Jeans, Carl Philip Taussig
-
Publication number: 20070236876Abstract: An assembly device for a computer case and outer cover incorporating: a host case provided with a bottom plate and perpendicular left and right side walls; a circuit motherboard fixed within the holding space, a jack panel of relatively small area and size is located at a tail end of the circuit motherboard, and an electrical circuit is printed on an inverse side of the jack panel; a rectangular outer cover; The outer cover can be assembled/disassembled to/from the rectangular gap of the host case, and the jack panel can be plugged into or withdrawn from the socket, thereby realizing a rapid and convenient method of assembling and disassembling the outer cover to and from the host case.Type: ApplicationFiled: April 10, 2006Publication date: October 11, 2007Inventors: Richard Chen, Albert Hua
-
Patent number: 7071548Abstract: An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains ?-amino propyltriethoxysilane in organic solution.Type: GrantFiled: October 30, 2003Date of Patent: July 4, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Albert Hua Jeans, Ping Mei
-
Patent number: 6762113Abstract: A method of coating a semiconductor substrate material with a coating material consisting of the steps of mixing an adhesion promoter with a coating material and applying the mixture to a semiconductor substrate material. The invention also includes means for coating a semiconductor substrate material with a coating material comprising means for mixing adhesion promoters with coating materials and means for applying the mixture of adhesion promoters and coating materials to a semiconductor substrate.Type: GrantFiled: April 26, 2002Date of Patent: July 13, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Albert Hua Jeans, Ping Mei
-
Publication number: 20040097097Abstract: A method of coating a semiconductor substrate material with a coating material consisting of the steps of mixing an adhesion promoter with a coating material and applying the mixture to a semiconductor substrate material. The invention also includes means for coating a semiconductor substrate material with a coating material comprising means for mixing adhesion promoters with coating materials and means for applying the mixture of adhesion promoters and coating materials to a semiconductor substrate.Type: ApplicationFiled: October 30, 2003Publication date: May 20, 2004Inventors: Albert Hua Jeans, Ping Mei
-
Publication number: 20030203621Abstract: A method of coating a semiconductor substrate material with a coating material consisting of the steps of mixing an adhesion promoter with a coating material and applying the mixture to a semiconductor substrate material. The invention also includes means for coating a semiconductor substrate material with a coating material comprising means for mixing adhesion promoters with coating materials and means for applying the mixture of adhesion promoters and coating materials to a semiconductor substrate.Type: ApplicationFiled: April 26, 2002Publication date: October 30, 2003Inventors: Albert Hua Jeans, Ping Mei