Patents by Inventor Albert K. Bachman

Albert K. Bachman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming metallization patterns on beam lead semiconductor devices
    Patent number: 4011144
    Abstract: Methods of forming conductive paths including beam leads on a surface of a semiconductor wafer includes the deposition of conductive films of materials such as titanium and platinum on the surface as a base for a subsequent deposition of a metal, such as gold. By selectively etching the titanium and platinum films, patterns of the desired conductors are generated. An intermediate masking step shields the surface of the wafer while the beam leads are plated prior to gold plating the remaining conductors of the pattern.
    Type: Grant
    Filed: December 22, 1975
    Date of Patent: March 8, 1977
    Assignee: Western Electric Company
    Inventor: Albert K. Bachman