Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: An apparatus drives and guides movement of a display assembly that includes a display unit. At least one track extends along at least one side of the display assembly and defines a path along which the display assembly is driven. A plurality of pins extend from the display assembly to the at least one track. At least one constant force spring has at one end a coiled part that is rotatably coupled to the display assembly, and an opposing end fastened to a fixed mounting location, and an uncoiled part extending between the coiled part and the opposing end. The at least one constant force spring is configured to drive the display assembly from a lowered position to a raised position while the plurality of pins travels along the at least one track and guide movement of the display assembly.

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

Abstract: An apparatus drives and guides movement of a display assembly that includes a display unit. At least one track extends along at least one side of the display assembly and defines a path along which the display assembly is driven. A plurality of pins extend from the display assembly to the at least one track. At least one constant force spring has at one end a coiled part that is rotatably coupled to the display assembly, and an opposing end fastened to a fixed mounting location, and an uncoiled part extending between the coiled part and the opposing end. The at least one constant force spring is configured to drive the display assembly from a lowered position to a raised position while the plurality of pins travels along the at least one track and guide movement of the display assembly.

Abstract: Described herein are systems, modes, and methods for mounting one or more electronic housings to each other and to a rack mount system, a table mount system, or wall mount system. The mounting system includes a first pair of matching sliding panels that interface with each other in a slidingly engaging manner. Each of the first pair of sliding panels can be mounted to housings prior to being engaged with each other; the engagement of the first pair of sliding panels removably fixes the two housings together; additional housings can be fixed to the first two in a substantially similar manner. The first pair of sliding panels includes a U-shaped sliding panel and a C-shaped sliding panel, and according to a second embodiment, a second pair of sliding panels includes a C-shaped sliding panel and a Pi-shaped sliding panel. The second pair of sliding panels operates in a substantially similar manner as the first pair of sliding panels.

Abstract: Described herein are systems, modes, and methods for mounting one or more electronic housings to each other and to a rack mount system, a table mount system, or wall mount system. The mounting system includes a first pair of matching sliding panels that interface with each other in a slidingly engaging manner. Each of the first pair of sliding panels can be mounted to housings prior to being engaged with each other; the engagement of the first pair of sliding panels removably fixes the two housings together; additional housings can be fixed to the first two in a substantially similar manner. The first pair of sliding panels includes a U-shaped sliding panel and a C-shaped sliding panel, and according to a second embodiment, a second pair of sliding panels includes a C-shaped sliding panel and a Pi-shaped sliding panel. The second pair of sliding panels operates in a substantially similar manner as the first pair of sliding panels.

Abstract: An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

Abstract: An apparatus cools electronic circuitry. A housing encloses the electronic circuitry and includes a plurality of surfaces, each configured to face an adjacent inner wall of the back box upon the housing being mounted inside the back box. A rear surface faces a rear wall of the inner walls of the back box. A mounting plate is disposed opposite to the rear surface, is in thermal contact with the housing, and faces away from the back box. A touch plate is atop of, and in thermal contact with, the mounting plate. The mounting plate and the touch plate combine to provide a path for conducting heat generated by the electronic circuitry away from the housing and for radiating the heat to ambient air. The mounting plate or the touch plate is made of a higher thermal conductivity material to facilitate conduction of heat away from the housing.

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

Abstract: An apparatus drives and guides movement of a display assembly that includes a display unit. At least one track extends along at least one side of the display assembly and defines a path along which the display assembly is driven. A plurality of pins extend from the display assembly to the at least one track. At least one constant force spring has at one end a coiled part that is rotatably coupled to the display assembly, and an opposing end fastened to a fixed mounting location, and an uncoiled part extending between the coiled part and the opposing end. The at least one constant force spring is configured to drive the display assembly from a lowered position to a raised position while the plurality of pins travels along the at least one track and guide movement of the display assembly.

Abstract: An integrated latching mechanism includes a slider button. At least one curved elastic arm extends from the slider button and is configured such that in response to an external force urging the slider button in a first direction, the curved elastic arm is distorted such that upon removal of the external force, the curved elastic arm moves the slider button in a direction opposite to the first direction. A locking part is contiguous with the slider button and extends away from the slider button. In response to the external force urging the slider button in the first direction, the locking part moves in the first direction, and upon removal of the external force, the curved elastic arm moves the locking part in the direction opposite to the first direction. The at least one curved elastic arm, the slider button, and the locking part form a single piece of elastic material.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau