Patents by Inventor Albert Perchtaler

Albert Perchtaler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of severing a semiconductor device composite
    Patent number: 9449879
    Abstract: A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: September 20, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Guido Weiss, Albert Perchtaler
  • METHOD OF SEVERING A SEMICONDUCTOR DEVICE COMPOSITE
    Publication number: 20160133520
    Abstract: A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 12, 2016
    Inventors: Guido Weiss, Albert Perchtaler
  • Method of severing a semiconductor device composite
    Patent number: 9263334
    Abstract: A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: February 16, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Guido Weiss, Albert Perchtaler
  • METHOD OF SEVERING A SEMICONDUCTOR DEVICE COMPOSITE
    Publication number: 20140248758
    Abstract: A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.
    Type: Application
    Filed: September 27, 2012
    Publication date: September 4, 2014
    Inventors: Guido Weiss, Albert Perchtaler