Patents by Inventor Albert van Zuijlen

Albert van Zuijlen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit arrangement
    Patent number: 9209118
    Abstract: An integrated circuit arrangement comprising a substrate and a flange disposed on top of the substrate. The flange comprises a cantilever portion configured to project over the substrate. A die disposed on top of the flange. A first output terminal disposed on the substrate. A first lead configured to provide for an electrical connection between the die and the first output terminal. A first electrically conducting member configured to provide at least part of a current return path between the substrate and the die and arranged to bridge a gap between the cantilever portion and the substrate. The first electrically conducting member is disposed between the die and the first output terminal and is configured to enable electrical current to flow from the substrate to the cantilever portion of the flange.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: December 8, 2015
    Assignee: NXP, B.V.
    Inventors: Vittorio Cuoco, Albert van Zuijlen, Josephus van der Zanden
  • INTEGRATED CIRCUIT ARRANGEMENT
    Publication number: 20150270198
    Abstract: An integrated circuit arrangement comprising a substrate and a flange disposed on top of the substrate. The flange comprises a cantilever portion configured to project over the substrate. A die disposed on top of the flange. A first output terminal disposed on the substrate. A first lead configured to provide for an electrical connection between the die and the first output terminal. A first electrically conducting member configured to provide at least part of a current return path between the substrate and the die and arranged to bridge a gap between the cantilever portion and the substrate. The first electrically conducting member is disposed between the die and the first output terminal and is configured to enable electrical current to flow from the substrate to the cantilever portion of the flange.
    Type: Application
    Filed: March 16, 2015
    Publication date: September 24, 2015
    Inventors: Vittorio Cuoco, Albert van Zuijlen, Josephus van der Zanden