Abstract: A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide a highly efficient system for heat removal from the IC chip. By reducing the size of the lateral fins, additional space is made available for the dual fans. The use of the dual fans allows the fans to run at a lower speed that a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan system if one of the fans should fail.

Abstract: A heat sink having an air flow director on each of multiple fins attached to a heat sink base. The air flow directors direct most of the air flow from dual push-pull fans towards a midline and a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. The rest of the air flow from the push-pull fans impinges against the air flow directors, providing additional cooling to the fins.

Abstract: A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. In one embodiment, a protrusion in the geometric center of the heat sink base provides additional cooling from air impingement, and also directs air towards the upper portions of the fins. The use of dual fans allows the fans to run at a lower speed than a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan if one of the fans should fail.

Abstract: A heat removal system for a computer has a heat sink and a spool rotatably disposed in the heat sink. The spool includes fluid inlets and outlets, and water circulates in a closed loop from the inlets, through the spool, through the outlets, past the computer component to be cooled, and between the heat sink and the spool to transfer heat to the heat sink, then back to the inlets. A thermally conductive can is between the heat sink and spool such that the working fluid flows between the can and spool.

Abstract: A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink and in a position relative to the fan for moving air over cooling surfaces of the heat sink and component to vibrationally isolate the fan from the heat sink and reduce the transmission of fan vibration to the heat sink. In one embodiment, the vibration isolation component is also configured to receive the fan and secure the fan in position relative to the heat sink to locate the fan in a predetermined position relative to the heat sink. In another embodiment, the vibration isolation component comprises a compliant gasket defining an opening adapted to receive an active area of the fan to allow air flow generated by the fan to reach the heat sink.

Abstract: A grease applicator is assembled from three parts, a base unit, a cap unit and a slider unit. The base unit has tenons that couple with corresponding slots in the cap unit to form a cavity with a window opening on a first surface and a slider opening on a second surface where a plane parallel to the second surface is perpendicular to a plane parallel to the first surface. A slider unit is inserted into the slider opening and forms a top surface to the window opening and forming a window cavity for containing a predetermined amount and volumetric shape of grease. The grease applicator is applied to a heat sink with the grease in the window cavity contacting a surface of the heat sink. The slider unit is extracted while pressure is applied to a surface of the grease applicator applying a uniform volume of grease.

Abstract: A device for use in cooling a microelectronic component in a data processing system with a heat sink and a fan. The device includes means for maintaining the fan in close proximity to the heat sink and in a position relative to the fan for moving air over cooling surfaces of the heat sink and component to vibrationally isolate the fan from the heat sink and reduce the transmission of fan vibration to the heat sink. In one embodiment, the vibration isolation component is also configured to receive the fan and secure the fan in position relative to the heat sink to locate the fan in a predetermined position relative to the heat sink. In another embodiment, the vibration isolation component comprises a compliant gasket defining an opening adapted to receive an active area of the fan to allow air flow generated by the fan to reach the heat sink.

Abstract: A circuit card includes a key receptacle and at least one movable braking member, holding the circuit card in place within a card receptacle of an electronic device when a key is not fully inserted within the key receptacle. When the key is so inserted, the circuit card can be easily removed. Preferably, the key includes a releasable latch holding the key within the key receptacle.

Abstract: A grease applicator is assembled from three parts, a base unit, a cap unit and a slider unit. The base unit has tenons that couple with corresponding slots in the cap unit to form a cavity with a window opening on a first surface and a slider opening on a second surface where a plane parallel to the second surface is perpendicular to a plane parallel to the first surface. A slider unit is inserted into the slider opening and forms a top surface to the window opening and forming a window cavity for containing a predetermined amount and volumetric shape of grease. The grease applicator is applied to a heat sink with the grease in the window cavity contacting a surface of the heat sink. The slider unit is extracted while pressure is applied to a surface of the grease applicator applying a uniform volume of grease.