Abstract: A non-volatile ferroelectric memory device is proposed which comprises a combination of an organic ferroelectric polymer with an organic ambipolar semiconductor. The devices of the present invention are compatible with—and fully exploit the benefits of polymers, i.e. solution processing, low-cost, low temperature layer deposition and compatibility with flexible substrates.

Abstract: A memory matrix (10) comprises rows and columns of cells, each cell comprising a resistance hysteresis element (24) and a threshold element (22) coupled in series between a row terminal and a column terminal of the cell (20). The resistance hysteresis element (24) has a mutually larger and smaller hysteresis thresholds of mutually opposite polarity respectively. Voltage differences are applied between the column terminals and the row terminals of cells (20) in a selected row, so as to perform read actions. These voltage differences have a read polarity so that the voltage across the cell (20) is in a direction corresponding to the larger hysteresis threshold. Voltage differences are applied between the column terminals and the row terminals of cells (20) in a selected row, so as to perform erase actions, all cells (20) of a selected row being erased collectively in the erase action. The voltage differences for erase actions have the read polarity.

Abstract: A control circuit (1, 11) for a memory matrix is used that defines a write process that uses circuit state transitions between at least two idle circuit states, an all column update circuit state and a column selective update state. In the second. During access the control circuit switches back and forth to the column selective update state (W) from the first idle state (II) during execution of a column selective update command and back and forth to the all-column update state (E) from the second idle state (12) during execution of an all column update command. The control circuit (1, 11) is retained in the first and second idle state (II, 12), without switching to the second and first idle state (12, II) between execution of successive column selective update commands and all column update commands respectively.

Abstract: A memory matrix (10) comprises rows and columns of cells, each cell comprising a resistance hysteresis element (24) and a threshold element (22) coupled in series between a row terminal and a column terminal of the cell (20). The resistance hysteresis element (24) has a mutually larger and smaller hysteresis thresholds of mutually opposite polarity respectively. Voltage differences are applied between the column terminals and the row terminals of cells (20) in a selected row, so as to perform read actions. These voltage differences have a read polarity so that the voltage across the cell (20) is in a direction corresponding to the larger hysteresis threshold. Voltage differences are applied between the column terminals and the row terminals of cells (20) in a selected row, so as to perform erase actions, all cells (20) of a selected row being erased collectively in the erase action. The voltage differences for erase actions have the read polarity.

Abstract: A control circuit (1, 11) for a memory matrix is used that defines a write process that uses circuit state transitions between at least two idle circuit states, an all column update circuit state and a column selective update state. In the second. During access the control circuit switches back and forth to the column selective update state (W) from the first idle state (II) during execution of a column selective update command and back and forth to the all-column update state (E) from the second idle state (12) during execution of an all column update command. The control circuit (1, 11) is retained in the first and second idle state (II, 12), without switching to the second and first idle state (12, II) between execution of successive column selective update commands and all column update commands respectively.

Abstract: The present invention relates to non-volatile ferroelectric memory devices (30) comprising a transistor (22) and a capacitor (23), and more particularly to non-volatile electrically erasable programmable ferroelectric memory elements, and a method for processing such non-volatile ferroelectric memory devices (30). The method according to the invention comprises a limited number of mask steps because a gate dielectric layer of the transistor (22) and a dielectric layer of the capacitor (23) are made from the same organic or inorganic ferroelectric layer (14).

Abstract: A memory (10) is organized as a matrix rows and columns of memory cell circuits (100) and comprises bit line conductors (12) coupled to rows of the memory cells (100). A sensing circuit (14) is coupled to the bit line conductors (12). The sensing circuit (14) is arranged to form respective data signals, each by comparing a respective signal from a plurality of the bit line conductors (12) with a reference level that is common for the bit line conductors (12). A reference level selection circuit (16) with inputs coupled to the plurality of bit line conductors (12) is arranged to control the reference level. The reference level selection circuit (16) selects the reference level dependent on respective analog signal levels on the plurality of the bit line conductors (12), so that analog signal levels from at least respective ones of the plurality of bit line conductors (12) lie on respective sides of the reference level.