Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

Abstract: A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.

Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.

Abstract: A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.

Abstract: A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.

Abstract: A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket. The invention also provides a method for securing a fluid filled chamber to a surface by using embodiments of the fastener assembly.

Abstract: Provided is a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

Abstract: A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract: Systems and methods for exciting long slot radiators of an RF antenna are provided. In one embodiment, the invention relates to a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

Abstract: A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.

Abstract: Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.