Patents by Inventor Alberto Montalvo

Alberto Montalvo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Physically separating printed circuit boards with a resilient, conductive contact
    Patent number: 5999414
    Abstract: A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: December 7, 1999
    Assignee: California Institute of Technology
    Inventors: John D. Baker, Alberto Montalvo