Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements-comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

Abstract: A thermalization arrangement at cryogenic temperatures is disclosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive.

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

Abstract: The invention is directed to a multi layer film to be used as a flexible packaging material for enclosing and containing one or more compressible products in a sealed condition. The 5 layer film according to the invention consists of I. a first layer comprising low density polyethylene, II. a second layer comprising high density polyethylene, III. a third layer comprising linear low density polyethylene, IV. a fourth layer comprising high density polyethylene and V. a fifth layer comprising linear low density polyethylene.

Abstract: The invention is directed to a multi layer film to be used as a flexible packaging material for enclosing and containing one or more compressible products in a sealed condition. The 5 layer film according to the invention consists of I. a first layer comprising low density polyethylene, II. a second layer comprising high density polyethylene, III. a third layer comprising linear low density polyethylene, IV. a fourth layer comprising high density polyethylene and V. a fifth layer comprising linear low density polyethylene.