Abstract: A thermalization arrangement at cryogenic temperatures is dislcosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive. The substrate layer and the conductive layer have similar acoustic properties.

Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements-comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

Abstract: According to an aspect, there is provided a Coulomb blockade thermometer comprising an input electrode; an output electrode; and a sensor component coupled in-between the input and output electrodes. The sensor component comprises: an array of tunnel junctions comprising at least one row of tunnel junctions and first and second heat sinks. The tunnel junctions of the array comprise an insulating layer forming a tunnel barrier between two electrically conducting volumes which are characterized by an absence of superconductivity. The absence of superconductivity is achieved by using titanium tungsten layers or scandium layers. The at least one row comprises first, second and third tunnel junctions. The first heat sink is coupled to the first and second tunnel junctions. The second heat sink is coupled to the second and third tunnel junctions. The first and the second heat sinks are arranged to provide heat dissipation via electron-phonon coupling.

Abstract: An attenuator arranged to thermalize radio frequency components, or a dissipating element arranged to thermalize lower frequency components than the radio frequency components, comprising: at least a first heat sink and a second heat sink; and at least one tunnel junction coupled to the first heat sink and the second heat sink, wherein the first heat sink and the second heat sink are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h e 2 , ?and/or a total capacitance of the first heat sink is above e 2 2 ? k b ? T ?and a total capacitance of the second heat sink is above e 2 2 ? k b ? T , ?wherein h is the Planck constant, e is the elementary charge, kb is the Boltzmann constant and T is the minimum temperature, where the attenuator or the dissipating element is arranged to be used.

Abstract: A device for shielding at least one component from thermal radiation, the device comprising at least a first substrate with a first surface and a second surface and a second substrate with a first surface and second surface, the first surface of the second substrate being arranged to at least partially face the second surface of the first substrate. The device additionally comprises at least a first component arranged on the first surface of the second substrate or the second surface of the first substrate and a shielding arrangement comprising a plurality of shielding elements-comprising electrically conductive material, the shielding elements being configured to essentially surround at least the first component to provide a shielded area within which the first component is located, wherein electromagnetic radiation having wavelength longer than a selected first wavelength is essentially prevented from reaching the shielded area.

Abstract: A thermalization arrangement at cryogenic temperatures is disclosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive.

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

Abstract: An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

Abstract: The invention is directed to a multi layer film to be used as a flexible packaging material for enclosing and containing one or more compressible products in a sealed condition. The 5 layer film according to the invention consists of I. a first layer comprising low density polyethylene, II. a second layer comprising high density polyethylene, III. a third layer comprising linear low density polyethylene, IV. a fourth layer comprising high density polyethylene and V. a fifth layer comprising linear low density polyethylene.

Abstract: The invention is directed to a multi layer film to be used as a flexible packaging material for enclosing and containing one or more compressible products in a sealed condition. The 5 layer film according to the invention consists of I. a first layer comprising low density polyethylene, II. a second layer comprising high density polyethylene, III. a third layer comprising linear low density polyethylene, IV. a fourth layer comprising high density polyethylene and V. a fifth layer comprising linear low density polyethylene.