Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.

Abstract: A reconfigurable bandstop filter and methods of designing and reconfiguring the bandstop filter are disclosed. The reconfigurable bandstop filter includes a plurality of transmission lines each including a phase shifter. The reconfigurable bandstop filter further includes a signal input port having a phase shifter and a signal output port having a phase shifter. The signal input port and the signal output port is coupled to the plurality of transmission lines.

Abstract: A switched capacitor is provided. The switched capacitor includes a pair of parallel component stacks. Each stack is connected to a common top node and a common bottom node. Each stack includes a BJT. Each stack further includes a first resistor in series with the BJT and having a first side connected to a collector of the BJT at an intermediate node in a same one of the stacks and a second side connected to the common top node. Each stack also includes a capacitor having a first side connected to the intermediate node and a second side for providing an impedance. Each stack additionally includes a second resistor having a first side connected to a base of the BJT to prevent base-current surge in the BJT and a second side connected to a switch base control signal that selectively turns the BJT on or off.

Abstract: Methods and systems for phase shifting include a hybrid quadrature coupler having an input, an output, and two termination loads. Each termination load includes multiple terminations, each termination having a varactor; and one or more transmission lines separating the terminations. A control module is configured to determine a phase shift and gain to apply to the input and to independently control a capacitance of each varactor such that the output of the hybrid quadrature coupler is shifted by the determined phase shift relative to the input with the determined gain.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Methods and systems for controlling variable gain amplifiers include setting a phase at a phase shifter in each of multiple of front-ends of a phased array transceiver, accounting for a constant phase shift of a phase-invariant variable gain amplifier. A gain is set at the phase-invariant variable gain amplifier in each of the multiple front-ends to perform tapering of beam pattern side lobes. A resistance in the phase-invariant variable gain amplifier is set to provide a phase shift that is independent of gain.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Methods for frequency multiplying include receiving a signal having an input frequency at a frequency multiplier comprising a pair of transistors; and selecting a harmonic in the signal by connecting the transistors to a common impedance through a respective collector impedance, wherein an output frequency at the harmonic between the collector impedances and the common impedance is an even integer multiple of an input frequency.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: A reconfigurable branch line coupler and methods of designing and reconfiguring the branch line coupler are disclosed. The reconfigurable branch line coupler includes a plurality of transmission lines, each of which comprises a phase shifter. The reconfigurable branch line coupler further includes an input port, which is split into two quadrature signals providing a second and third port between adjacent of the plurality of transmission lines, with a fourth port isolated from the input port at a center frequency.

Abstract: A reconfigurable rat race coupler and methods of designing and reconfiguring the rat race coupler are disclosed. The reconfigurable rat race coupler, includes a plurality of transmission lines. The plurality of transmission lines include: a first transmission line and a second transmission line each of which comprise a phase shifter; and a third transmission line and a fourth transmission line each of which comprise phase shifters. A signal input on port 1 is provided between the phase shifters on the third transmission line, which is split between ports 2 and 3, with port 4 being isolated and port 2 being between the phase shifters on the fourth transmission line.

Abstract: A voltage controlled oscillator comprises a negative resistance, a first inductor, a fixed capacitor, and a frequency control component. The frequency control component comprises at least one varactor and at least a second inductor connected in series with the at least one varactor. A magnitude of an inductance of the second inductor is selected such that the frequency control component has an effective capacitance range larger than a capacitance range of the at least one varactor.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.