Abstract: The present invention relates to a press part (1,20,30,40) for supporting a mould part for encapsulating electronic components mounted on a carrier comprising a press block (2, 42), which press block comprises a contact surface (3), a side (4) facing away from the contact surface and at least one side wall (5) connecting the contact surface (3) and the side (4) facing away from the contact surface(3), wherein the press block (2, 42) comprises at least two opposed elements (6a, 6b, 21a, 21b, 31a, 31b, 31c, 31d, 44) protruding from the side wall (5), and wherein the side wall (5) transposes via only a recess (7) into each of the protruding elements (6a, 6b, 21a 21b, 31a 31b, 31c 31d 44). The present invention further relates to a press comprising the press part of the present invention.

Abstract: The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

Abstract: The present invention relates to a press part (1,20,30,40) for supporting a mould part for encapsulating electronic components mounted on a carrier comprising a press block (2, 42), which press block comprises a contact surface (3), a side (4) facing away from the contact surface and at least one side wall (5) connecting the contact surface (3) and the side (4) facing away from the contact surface (3), wherein the press block (2, 42) comprises at least two opposed elements (6a, 6b, 21a, 21b, 31a, 31b, 31c, 31d, 44) protruding from the side wall (5), and wherein the side wall (5) transposes via only a recess (7) into each of the protruding elements (6a, 6b, 21a 21b, 31a 31b, 31c 31d 44). The present invention further relates to a press comprising the press part of the present invention.

Abstract: A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.

Abstract: The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

Abstract: Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises:one or more pressing devices for encapsulating the products at increased pressure and/or temperature;a first carriage device for transferring the products from supply means to the pressing device; anda second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means.