Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: An optical temperature sensing system is disclosed which includes a fiber optic sensor as a primary temperature sensor for reading a temperature of a measured object or a measured environment. The temperature probe is coupled to a converter which generates using solid-state electronic components without software, a temperature output. A temperature sensing system is also disclosed that includes a temperature sensor for reading a temperature of a measured object, and a dual converter module comprising a first converter to provide a primary temperature sensor signal, and a second converter to generate a secondary temperature sensor signal from a signal provided by the first converter. An optical temperature sensor is also described, with a conversion module that generates an output that mimics the output of a thermistor or a thermocouple.

Abstract: The following provides a system and method for 2-D thermal imaging of phosphor coated surfaces. The system and method enable increased temperature measurement accuracy and speed of data analysis by implementing a control system that controls simultaneously an illumination system and an image capture device including a high speed camera. More particularly, the control system can control the illumination system and the camera to acquire images when emitted light intensity ranges are in a desired range to improve temperature measurement accuracy, and to increase the speed of data processing.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

Abstract: In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.