Abstract: A method for the production of glass or glass ceramic elements from flat glass or glass ceramic parts is provided where the edges of the glass or glass ceramic elements are treated by a combination of two processes. The flat glass or glass ceramic element with an edge surface connecting the two side surfaces is produced. The edge surface has at least one first elongated, strip-shaped edge region and at least one second elongated strip-shaped edge region, which are formed by a ground edge. The edge regions extend in the longitudinal direction along the edge surface and along the side surfaces. The first edge region has elongated parallel filamentary damages that are parallel and adjacent to one another and, in particular, spaced apart equidistantly, in the longitudinal direction thereof extending transversely to the side surfaces and along the surface of the first edge region.

Abstract: A method provides for producing modifications in or on a transparent workpiece using a laser processing device. The laser processing device has a short pulse or ultrashort pulse laser that emits laser radiation having a wavelength in the transparency range of the workpiece and which has a beam-shaping optical unit for beam shaping for focusing the laser radiation. The transparent workpiece is composed of a material that has a plurality of phases, of which at least two phases have different dielectric constants, of which in turn the one phase is a phase embedded in the form of particles, which phase is substantially surrounded by the other phase, and wherein the product of the volume of the particles specified in cubic nanometers and the ratio of the absolute value of the difference of the two different dielectric constants to the dielectric constant of the surrounding phase is greater than 500.

Abstract: A method provides for producing modifications in or on a transparent workpiece using a laser processing device. The laser processing device has a short pulse or ultrashort pulse laser that emits laser radiation having a wavelength in the transparency range of the workpiece and which has a beam-shaping optical unit for beam shaping for focusing the laser radiation. The transparent workpiece is composed of a material that has a plurality of phases, of which at least two phases have different dielectric constants, of which in turn the one phase is a phase embedded in the form of particles, which phase is substantially surrounded by the other phase, and wherein the product of the volume of the particles specified in cubic nanometers and the ratio of the absolute value of the difference of the two different dielectric constants to the dielectric constant of the surrounding phase is greater than 500.

Abstract: A method is provided that includes producing filamentary damages in a volume of a glass or glass ceramic element adjacently aligned along a separation line and extend obliquely relative to a surface of the glass or glass ceramic element; and separating a portion from the glass or glass ceramic element along the separation line. The step of producing the filamentary damages includes directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface; generating a plasma within the volume with the laser pulses; and displacing the laser pulses at points of incidence over the surface along the separation line.

Abstract: A lighting device includes: at least one laser light source configured to emit a light beam; and a light conversion element associated with the at least one laser light source and arranged in the beam path of at least one light beam generated by at least one laser light source such that at least a portion of the light beam emitted by the at least one laser light source is directed onto the light conversion element, and in such a way that a laser light spot is illuminated on a face of the light conversion element facing the incident light beam, the light conversion element comprising a material which, through scattering, absorption and conversion of the incident laser light, emits and scatters light of a larger wavelength.

Abstract: Devices and methods for processing a workpiece along a predetermined processing line are provided. The device includes: a pulsed, polychromatic laser beam generator; an optical arrangement; and a moving device. The laser beam generator generates a laser beam along a beam direction. The optical arrangement generates a focal line along the beam direction. The optical arrangement has a chromatic aberration for wavelength-dependent focusing of the laser beam and a filter for wavelength-dependent filtering of the laser beam. The moving device generates relative movement between the laser beam and the workpiece along the predetermined processing line.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: An optical converter is provided that has both a stable colour even at highest luminous powers and a high luminous efficiency. The optical converter includes a ceramic element that is fluorescent so that light of a first wavelength is absorbed in the ceramic element and fluorescent having longer wavelength light is emitted. The ceramic element includes pores spatially irregularly distributed within the ceramic element. The distribution of the pores within the ceramic element is inhomogeneous so that the radial distribution function of the pore locations deviates from unity and has a maximum at a characteristic distance, the maximum having a value of at least 1.2.

Abstract: A method for the production of glass or glass ceramic elements from flat glass or glass ceramic parts is provided where the edges of the glass or glass ceramic elements are treated by a combination of two processes. The flat glass or glass ceramic element with an edge surface connecting the two side surfaces is produced. The edge surface has at least one first elongated, strip-shaped edge region and at least one second elongated strip-shaped edge region, which are formed by a ground edge. The edge regions extend in the longitudinal direction along the edge surface and along the side surfaces. The first edge region has elongated parallel filamentary damages that are parallel and adjacent to one another and, in particular, spaced apart equidistantly, in the longitudinal direction thereof extending transversely to the side surfaces and along the surface of the first edge region.

Abstract: A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 ?m and 10 m. The dielectric workpiece can have a specially formed edge.

Abstract: A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

Abstract: A method is provided that includes producing filamentary damages in a volume of a glass or glass ceramic element adjacently aligned along a separation line and extend obliquely relative to a surface of the glass or glass ceramic element; and separating a portion from the glass or glass ceramic element along the separation line. The step of producing the filamentary damages includes directing laser pulses of an ultrashort pulse laser obliquely on the surface so that the laser pulses have a light propagation direction that extends obliquely relative to the surface and so that the filamentary damages resulting from the laser pulses have the longitudinal extension that extends obliquely relative to the surface; generating a plasma within the volume with the laser pulses; and displacing the laser pulses at points of incidence over the surface along the separation line.

Abstract: A method provides for producing modifications in or on a transparent workpiece using a laser processing device. The laser processing device has a short pulse or ultrashort pulse laser that emits laser radiation having a wavelength in the transparency range of the workpiece and which has a beam-shaping optical unit for beam shaping for focusing the laser radiation. The transparent workpiece is composed of a material that has a plurality of phases, of which at least two phases have different dielectric constants, of which in turn the one phase is a phase embedded in the form of particles, which phase is substantially surrounded by the other phase, and wherein the product of the volume of the particles specified in cubic nanometers and the ratio of the absolute value of the difference of the two different dielectric constants to the dielectric constant of the surrounding phase is greater than 500.

Abstract: A cutting mill for crushing broken polycrystalline needle-shaped silicon material, which contains particles that have an aspect ratio of AI with 5<AI ?30, and/or broken Si wafer consisting of laminar particles, wherein the cutting mill has an interior space that is lined with silicon and/or plastic, wherein the cutting mill has a rotational body configured as a multi-sided column, wherein said rotational body, in the regions facing the interior space of the cutting mill, is lined with silicon or features silicon, and wherein blades which run parallel with the longitudinal edges of the rotational body and are disposed in the rotational area of the rotational body, are arranged in the interior space of the cutting mill, and are adjustable with respect to the rotational body.

Abstract: A method for producing crystallized silicon according to the EFG process by using a shaping part, between which part and a silicon melt, crystallized silicon grows in a growth zone. Inert gas and at least water vapor are fed into the silicon melt and/or growth zone, by means of which the oxygen content of the crystallized silicon is increased. From 50 to 250 ppm of vapor water is added to the inert gas, and the inert gas has an oxygen, CO and/or CO2 content of less than 20 ppm total.

Abstract: Methods and apparatus for separating of parts from workpieces is provided, in which at least one part is separated from a workpiece by means of radiation, in particular by means of laser radiation, and in which the radiation acts on the workpiece in a zone of interaction in such a way that regions of the workpiece are abraded, changed in their shape and/or are separated; in which the light intensity is received from the interaction zone and/or its vicinity and is transformed into electrical signals by a photoelectric sensor, and in which, with use of the electrical signals, it is determined when the processing procedure is to be terminated.

Abstract: A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio AI, 5<AI?30, is used as a starting material. Material I is crushed so that the crushed particles (material II) have an aspect ratio AII<3. Alternatively, a broken Si wafer is used that is composed of laminar particles which are crushed so that the crushed particles (material III) have an aspect ratio AIII<3.

Abstract: A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio AI, 5<A1?30, is used as a starting material. Material I is crushed so that the crushed particles (material II) have an aspect ratio AII<3. Alternatively, a broken Si wafer is used that is composed of laminar particles which are crushed so that the crushed particles (material III) have an aspect ratio AIII<3.

Abstract: A method for recovering and/or recycling starting silicon material by crushing the starting material. The recovered or recycled material is melted, and crystals, e.g. as a silicon block, tube, or strip, are grown from the obtained melt. To use starting materials that have a high aspect ratio to be able to convey the same without any problem, broken polycrystalline needle-shaped Si material (material I) containing particles having an aspect ratio AI, 5<A1?30, is used as a starting material. Material I is crushed so that the crushed particles (material II) have an aspect ratio AII<3. Alternatively, a broken Si wafer is used that is composed of laminar particles which are crushed so that the crushed particles (material III) have an aspect ratio AIII<3.

Abstract: A method for producing crystallized silicon according to the EFG process by using a shaping part, between which part and a silicon melt, crystallized silicon grows in a growth zone. Inert gas and at least water vapor are fed into the silicon melt and/or growth zone, by means of which the oxygen content of the crystallized silicon is increased. From 50 to 250 ppm of vapor water is added to the inert gas, and the inert gas has an oxygen, CO and/or CO2 content of less than 20 ppm total.