Abstract: To test for proper connections of integrated-circuit connection pins (22) on a circuit board (12) to the conductive paths to which they should be connected, a tester (10) applies signals of different frequencies to paths to be connected to different IC pins provided by the same integrated-circuit package (24). The resultant composite electric-field signal in the vicinity of the integrated-circuit package (24) is coupled to a capacitive probe (42), and the probe signal is subjected to frequency analysis (58-1, 58-2 , . . . 58-J) to determine whether the applied frequency components are present in the signal with sufficient magnitudes. If the magnitude in the sensed signal of an applied frequency component is not great enough, the tester generates an indication that the corresponding IC pin has not been properly connected.

Abstract: A technique for automatically diagnosing the failure of electronic devices connected to share a common bus. All bus devices are first disabled, and the bus is examined to determine if a failed device is interfering with normal operation by causing the bus to be stuck at a logic high or a logic low level. If the bus is stuck low or high, a forcing voltage nearly equal to either V.sub.ol or V.sub.oh, respectively, is applied to the bus, with all devices still disabled. A disabled bus current is then measured. One at a time, the bus devices are enabled, and the current on the bus measured to determine an enabled bus current. If, for a particular device, the enabled bus current exceeds the disabled bus current by a predetermined amount depending on the drive current specification of the device, it is concluded that the particular device is operating properly.