Patents by Inventor Aldo Torti
Aldo Torti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7135891Abstract: Current through a wire is sensed with a shunt resistor and a sense resistor in a current divider circuit. The values of the shunt resistor and sense resistor are related to provide a specified gain ratio to increase a dynamic range of current measurement. The sense resistor is a trimmable resistor, the configuration of which can be discerned from a look-up table based on a level of precision needed for current measurement. The two resistors can also be related by thermal coefficients to improve linearity of current measurements.Type: GrantFiled: August 22, 2005Date of Patent: November 14, 2006Assignee: International Rectifier CorporationInventors: Massimo Grasso, Aldo Torti, Andrea Merello, Jonas Aleksandravicius
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Patent number: 7132698Abstract: A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. The annular flange preferably comprises a projection having a squared tab and circular distal end that is received by a receiving groove having a notch (to receive the squared tab) and a cavity (to receive the distal end).Type: GrantFiled: October 7, 2003Date of Patent: November 7, 2006Assignee: International Rectifier CorporationInventors: Mario Merlin, Aldo Torti
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Publication number: 20060049854Abstract: Current through a wire is sensed with a shunt resistor and a sense resistor in a current divider circuit. The values of the shunt resistor and sense resistor are related to provide a specified gain ratio to increase a dynamic range of current measurement. The sense resistor is a trimmable resistor, the configuration of which can be discerned from a look-up table based on a level of precision needed for current measurement. The two resistors can also be related by thermal coefficients to improve linearity of current measurements.Type: ApplicationFiled: August 22, 2005Publication date: March 9, 2006Inventors: Massimo Grasso, Aldo Torti, Andrea Merello, Jonas Aleksandravicius
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Publication number: 20050017760Abstract: Current through a wire is sensed with a shunt resistor and a sense resistor in a current divider circuit. The values of the shunt resistor and sense resistor are related to provide a specified gain ratio to increase a dynamic range of current measurement. The sense resistor is a trimmable resistor, the configuration of which can be discerned from a look-up table based on a level of precision needed for current measurement. The two resistors can also be related by thermal coefficients to improve linearity of current measurements.Type: ApplicationFiled: July 22, 2003Publication date: January 27, 2005Inventors: Massimo Grasso, Aldo Torti, Andrea Merello, Jonas Aleksandravicius
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Patent number: 6822184Abstract: A process for joining a steel terminal to a copper electrode comprises applying a thin silver-copper flash to the surface of a copper electrode and bringing a steel surface into contact with the flash during high frequency welding. The weldment is improved compared to conventional welds that do not incorporate the flash layer. For example, a silver—18 wt % copper alloy having a thickness of about 180 microns produced uniform, high quality welds between nickel steel terminals and 99.999% pure copper electrodes.Type: GrantFiled: October 22, 2003Date of Patent: November 23, 2004Assignee: International Rectifier CorporationInventors: Aldo Torti, Mario Merlin, Sebastiaro Ferrero
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Patent number: 6781227Abstract: A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. An annular flange may also be embedded in the plastic molded insulation ring and connected to an annular rib of a pole piece by a circular connector.Type: GrantFiled: January 25, 2002Date of Patent: August 24, 2004Assignee: International Rectifier CorporationInventors: Mario Merlin, Aldo Torti, Stefano Santi
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Publication number: 20040124180Abstract: A process for joining a steel terminal to a copper electrode comprises applying a thin silver-copper flash to the surface of a copper electrode and bringing a steel surface into contact with the flash during high frequency welding. The weldment is improved compared to conventional welds that do not incorporate the flash layer. For example, a silver—18 wt % copper alloy having a thickness of about 180 microns produced uniform, high quality welds between nickel steel terminals and 99.999% pure copper electrodes.Type: ApplicationFiled: October 22, 2003Publication date: July 1, 2004Applicant: International Rectifier Corp.Inventors: Aldo Torti, Mario Merlin, Sebastiaro Ferrero
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Publication number: 20040119089Abstract: A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. The annular flange preferably comprises a projection having a squared tab and circular distal end that is received by a receiving groove having a notch (to receive the squared tab) and a cavity (to receive the distal end).Type: ApplicationFiled: October 7, 2003Publication date: June 24, 2004Applicant: International Rectifier CorporationInventors: Mario Merlin, Aldo Torti
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Publication number: 20030141517Abstract: A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. An annular flange may also be embedded in the plastic molded insulation ring and connected to an annular rib of a pole piece by a circular connector.Type: ApplicationFiled: January 25, 2002Publication date: July 31, 2003Applicant: International Rectifier CorporationInventors: Mario Merlin, Aldo Torti, Stefano Santi
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Patent number: 6559529Abstract: A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allow the housing to be forced into an opening in the bus, with either the housing bottom or the axial lead being the first to enter the openings.Type: GrantFiled: April 10, 2001Date of Patent: May 6, 2003Assignee: International Rectifier CorporationInventors: Aldo Torti, Mario Merlin, Emilio Mattiuzzo
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Patent number: 6489881Abstract: A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.Type: GrantFiled: October 27, 2000Date of Patent: December 3, 2002Assignee: International Rectifier CorporationInventors: Jonas Aleksandravicius, Gene Pranauskiene, Algirdas Kaskonas, Aldo Torti
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Publication number: 20020145189Abstract: A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allow the housing to be forced into an opening in the bus, with either the housing bottom or the axial lead being the first to enter the openings.Type: ApplicationFiled: April 10, 2001Publication date: October 10, 2002Applicant: International Rectifier Corp.Inventors: Aldo Torti, Mario Merlin, Emilio Mattiuzzo
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Patent number: 5391919Abstract: A semiconductor device module is formed of four identical frame sections which each have a flat base and perpendicularly extending strap terminal. Semiconductor chips are soldered to the center of the top surfaces of each base, and the devices are interconnected by flat brass strips having one end soldered to the top of one chip and the other end soldered to the base of an adjacent section. The base sections lie in a common plane at the bottom of an insulative filled insulation cup. The terminals extend parallel and out of the top of the cup.Type: GrantFiled: October 22, 1993Date of Patent: February 21, 1995Assignee: International Rectifier CorporationInventors: Aldo Torti, Emilio Mattiuzzo