Abstract: Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging substrate to create a microelectronics package. The underfill material is preferably applied by a noncontact dispensing technique as discrete amounts at interstitial areas on an active surface of the component substrate defined between nearest-neighbor solder bumps. The underfill material forms a continuous meniscus of underfill material across the interstitial areas not occupied by the solder bumps and forms a collar encircling each of the solder bumps. The cured underfill material strengthens and improves the reliability of the solder joints formed by the bump reflow.

Abstract: A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

Abstract: A dispensing pump for dispensing liquid, particularly suitable for dispensing two-part epoxy for encapsulation of integrated circuits, includes a pumping chamber in communication with a nozzle via a three way valve, the pumping chamber including an outlet, an internal volume, a pair of spaced directional seals located away from the outlet, an open volume reciting between the seals and an external port opening the open volume to atmosphere. A stepped plunger extends axially within the pumping chamber, with a first portion sized to be received and aligned through the first directional seal, the plunger being movable to move the first portion toward the outlet to close off the internal volume at the second seal. The second portion of the plunger is relatively smaller in transverse cross-sectional dimension than the inside diameter of the second seal, to cooperate with the port to promote fluid removal from the internal volume during initial filling and priming of the pumping chamber.

Abstract: A dispensing pump for dispensing liquid, particularly suitable for dispensing two-part epoxy for encapsulation of integrated circuits, includes a pumping chamber in communication with a nozzle via a three way valve, the pumping chamber including an outlet, an internal volume, a pair of spaced directional seals located away from the outlet, an open volume residing between the seals and an external port opening the open volume to atmosphere. A stepped plunger extends axially within the pumping chamber, with a first portion sized to be received and aligned through the first directional seal, the plunger being movable to move the first portion toward the outlet to close off the internal volume at the second seal. The second portion of the plunger is relatively smaller in transverse cross-sectional dimension than the inside diameter of the second seal, to cooperate with the port to promote fluid removal from the internal volume during initial filling and priming of the pumping chamber.