Patents by Inventor Alec Ekmekji

Alec Ekmekji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7631414
    Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: December 15, 2009
    Assignee: Raytheon Company
    Inventors: Avery Y. Quil, Clifton Quan, Alec Ekmekji, Jason G. Milne
  • Publication number: 20090044399
    Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.
    Type: Application
    Filed: August 13, 2007
    Publication date: February 19, 2009
    Inventors: Avery Y. Quil, Clifton Quan, Alec Ekmekji, Jason G. Milne
  • Patent number: 7432871
    Abstract: A true-time-delay feed network for a continuous transverse stub antenna array includes a plurality of feed levels, each comprising one or more rails, the feed levels arranged in a spaced configuration. An open parallel plate region is defined between adjacent ones of the feed levels. The rails of the plurality of feed levels are arranged to form a power divider network unencumbered with septums or wall portions protruding into the open region.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: October 7, 2008
    Assignee: Raytheon Company
    Inventors: William W. Milroy, Stuart B. Coppedge, Alec Ekmekji, Shahrokh Hashemi-Yeganeh, Steven G. Buczek
  • Publication number: 20060202899
    Abstract: A true-time-delay feed network for a continuous transverse stub antenna array includes a plurality of feed levels, each comprising one or more rails, the feed levels arranged in a spaced configuration. An open parallel plate region is defined between adjacent ones of the feed levels. The rails of the plurality of feed levels are arranged to form a power divider network unencumbered with septums or wall portions protruding into the open region.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 14, 2006
    Inventors: William Milroy, Stuart Coppedge, Alec Ekmekji, Shahrokh Hashemi-Yeganeh, Steven Buczek
  • Patent number: 6430805
    Abstract: Methods of fabricating air-filed true-time-delay, continuous transverse stub array antenna. A plurality of extruded sections that are physically independent of one another are fabricated. The plurality of extruded sections are arranged in a predefined pattern defining the structure of the array antenna. Adjacent surfaces of the extruded sections form waveguides of the array antenna. The plurality of extruded sections are joined together at their respective ends to form the array antenna. The plurality of extruded sections may be joined using a plurality of end plates. The plurality of extruded sections and end plates may comprise metal or plastic. If the extruded sections are plastic, they are metallized 44 using a process such as vacuum deposition, electroless plating, or lamination during the extrusion process. The end plates are sealed to the extruded sections to form the array antenna structure.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: August 13, 2002
    Assignee: Raytheon Company
    Inventors: Alec Ekmekji, Douglas O. Klebe, Shahrokh Hashemi-Yeganeh, William W. Milroy, Patrick J. Fitzgerald, Gerald A. Cox, Kenneth Nash