Patents by Inventor Alec Ekrnekjl

Alec Ekrnekjl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for producing large flat panel and conformal active array antennas
    Patent number: 8209846
    Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structures and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: July 3, 2012
    Assignee: Raytheon Company
    Inventors: Avery Y. Quil, Clifton Quan, Alec Ekrnekjl, Jason G. Milne
  • METHODS FOR PRODUCING LARGE FLAT PANEL AND CONFORMAL ACTIVE ARRAY ANTENNAS
    Publication number: 20100031495
    Abstract: Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.
    Type: Application
    Filed: September 25, 2009
    Publication date: February 11, 2010
    Inventors: Avery Y. Quil, Clifton Quan, Alec Ekrnekjl, Jason G. Milne