Patents by Inventor Alec Madsen
Alec Madsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7731546Abstract: A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.Type: GrantFiled: September 16, 2005Date of Patent: June 8, 2010Assignee: FormFactor, Inc.Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
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Publication number: 20070270041Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.Type: ApplicationFiled: September 16, 2005Publication date: November 22, 2007Inventors: Gary Grube, Gaetan Mathieu, Alec Madsen
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Patent number: 6945827Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.Type: GrantFiled: December 23, 2002Date of Patent: September 20, 2005Assignee: FormFactor, Inc.Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
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Patent number: 6825422Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.Type: GrantFiled: June 17, 2002Date of Patent: November 30, 2004Assignee: Formfactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
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Publication number: 20040177499Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.Type: ApplicationFiled: March 31, 2004Publication date: September 16, 2004Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
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Publication number: 20040121627Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.Type: ApplicationFiled: December 23, 2002Publication date: June 24, 2004Applicant: FormFactor, Inc.Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
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Publication number: 20030015347Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.Type: ApplicationFiled: June 17, 2002Publication date: January 23, 2003Applicant: FormFactor, IncInventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
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Patent number: 6441315Abstract: An apparatus providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.Type: GrantFiled: November 10, 1998Date of Patent: August 27, 2002Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu