Patents by Inventor Alec Madsen

Alec Madsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7731546
    Abstract: A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: June 8, 2010
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
  • Publication number: 20070270041
    Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
    Type: Application
    Filed: September 16, 2005
    Publication date: November 22, 2007
    Inventors: Gary Grube, Gaetan Mathieu, Alec Madsen
  • Patent number: 6945827
    Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: September 20, 2005
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
  • Patent number: 6825422
    Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: November 30, 2004
    Assignee: Formfactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
  • Publication number: 20040177499
    Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 16, 2004
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
  • Publication number: 20040121627
    Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.
    Type: Application
    Filed: December 23, 2002
    Publication date: June 24, 2004
    Applicant: FormFactor, Inc.
    Inventors: Gary W. Grube, Gaetan L. Mathieu, Alec Madsen
  • Publication number: 20030015347
    Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
    Type: Application
    Filed: June 17, 2002
    Publication date: January 23, 2003
    Applicant: FormFactor, Inc
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu
  • Patent number: 6441315
    Abstract: An apparatus providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: August 27, 2002
    Assignee: FormFactor, Inc.
    Inventors: Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Alec Madsen, Gaetan L. Mathieu