Patents by Inventor Alejandro Aldrin II Agcaoili Narag
Alejandro Aldrin II Agcaoili Narag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10424707Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.Type: GrantFiled: September 19, 2018Date of Patent: September 24, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Hiromitsu Kosugi
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Publication number: 20190035993Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.Type: ApplicationFiled: September 19, 2018Publication date: January 31, 2019Inventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Hiromitsu Kosugi
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Patent number: 10128422Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: GrantFiled: October 19, 2015Date of Patent: November 13, 2018Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Jian Xia Gao, Justine A. Mooney
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Patent number: 9754869Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.Type: GrantFiled: March 13, 2013Date of Patent: September 5, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Alejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Bee Leng Tan, Antonny Enojo Flor
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Publication number: 20170104143Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.Type: ApplicationFiled: May 26, 2015Publication date: April 13, 2017Inventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Hiromitsu Kosugi
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Patent number: 9564568Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: GrantFiled: September 21, 2015Date of Patent: February 7, 2017Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney
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Publication number: 20160049567Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.Type: ApplicationFiled: September 21, 2015Publication date: February 18, 2016Inventors: Ravi PALANISWAMY, Arokiaraj JESUDOSS, Alejandro Aldrin II Agcaoili NARAG, Siang Sin FOO, Fong Liang TAN, Andrew J. OUDERKIRK, Justine A. MOONEY
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Publication number: 20160043294Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: ApplicationFiled: October 19, 2015Publication date: February 11, 2016Inventors: Ravi PALANISWAMY, Alejandro Aldrin II Agcaoili NARAG, Jian Xia GAO, Justine A. MOONEY
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Publication number: 20150318237Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.Type: ApplicationFiled: March 13, 2013Publication date: November 5, 2015Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Alejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Antonny Enojo Flor
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Publication number: 20140321126Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.Type: ApplicationFiled: November 20, 2012Publication date: October 30, 2014Inventors: Alejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Arokiaraj Jesudoss, Justine A. Mooney
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Publication number: 20140153263Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.Type: ApplicationFiled: August 8, 2012Publication date: June 5, 2014Applicant: 3M Innovative Properties CompanyInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Jian Xia Gao, Justine A. Mooney
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Publication number: 20140036461Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.Type: ApplicationFiled: October 27, 2011Publication date: February 6, 2014Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, James R White, Fong Liang Tan, Andrew J Ouderkirk, Justine A Mooney, Nathan P Kreutter, Qihong Nie, Jian Xia Gao
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Publication number: 20130294471Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.Type: ApplicationFiled: October 27, 2011Publication date: November 7, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agcaoili Narag, James R. White, Fong Liang Tan, Andrew J. Ouderkirk, Justine A. Mooney, Nathan P. Kreutter, Qihong Nie, Jian Xia Gao