Patents by Inventor Alejandro Lacap

Alejandro Lacap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct positive image photo-resist transfer of substrate design
    Patent number: 6872321
    Abstract: A method of forming a photo-resist image on a substrate, such as a conductive film. The method provides that a photo-resist image is printed directly onto the conductive film, such as by using an ink jet printer. Specifically, a CAD image may be sent from a computer to the ink jet printer, and the ink jet printer may use the CAD image to print the photo-resist image. The method may provide that a copper film is applied to a dielectric substrate, and then the photo-resist image is printed directly onto the copper film. Then, at least a portion of the copper film is removed, such as by etching, and at least a portion of the photo-resist image which has been printed on the copper film is removed, such as by etching. By printing the photo-resist image directly onto the copper film, it is not necessary to perform steps such as: applying a mask, exposing to UV light, and developing.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: March 29, 2005
    Assignee: LSI Logic Corporation
    Inventors: Manickam Thavarajah, Aritharan Thurairajaratnam, Alejandro Lacap
  • Direct positive image photo-resist transfer of substrate design
    Publication number: 20040056939
    Abstract: A method of forming a photo-resist image on a substrate, such as a conductive film. The method provides that a photo-resist image is printed directly onto the conductive film, such as by using an ink jet printer. Specifically, a CAD image may be sent from a computer to the ink jet printer, and the ink jet printer may use the CAD image to print the photo-resist image. The method may provide that a copper film is applied to a dielectric substrate, and then the photo-resist image is printed directly onto the copper film. Then, at least a portion of the copper film is removed, such as by etching, and at least a portion of the photo-resist image which has been printed on the copper film is removed, such as by etching. By printing the photo-resist image directly onto the copper film, it is not necessary to perform steps such as: applying a mask, exposing to UV light, and developing.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 25, 2004
    Inventors: Manickam Thavarajah, Aritharan Thurairajaratnam, Alejandro Lacap