Abstract: A methane destruction apparatus for capturing and converting fugitive methane gas emissions into carbon dioxide and water comprises a methane-capturing module for capturing the fugitive methane gas emissions and a methane conversion module for receiving captured methane from the methane-capturing module. The methane-capturing module includes a fugitive methane gas emission intake connected to an emissions line having a backpressure equal to 1 to 3 inches of water (249 to 746 Pa), a natural gas feed for feeding natural gas into the methane-capturing module, may include a relief vent for preventing overpressure within the methane-capturing module and a drain for draining liquids that have condensed within the methane-capturing module. The methane conversion module includes a conversion pad for catalytically converting the captured methane into carbon dioxide and water, a water vapour opening for outputting the water and a carbon dioxide opening for outputting the carbon dioxide.

Abstract: A methane destruction apparatus for capturing and converting fugitive methane gas emissions into carbon dioxide and water comprises a methane-capturing module for capturing the fugitive methane gas emissions and a methane conversion module for receiving captured methane from the methane-capturing module. The methane-capturing module includes a fugitive methane gas emission intake connected to an emissions line having a backpressure equal to 1 to 3 inches of water (249 to 746 Pa), a natural gas feed for feeding natural gas into the methane-capturing module, may include a relief vent for preventing overpressure within the methane-capturing module and a drain for draining liquids that have condensed within the methane-capturing module. The methane conversion module includes a conversion pad for catalytically converting the captured methane into carbon dioxide and water, a water vapour opening for outputting the water and a carbon dioxide opening for outputting the carbon dioxide.

Abstract: A methane destruction apparatus for capturing and converting fugitive methane gas emissions into carbon dioxide and water comprises a methane-capturing module for capturing the fugitive methane gas emissions and a methane conversion module for receiving captured methane from the methane-capturing module. The methane-capturing module includes a fugitive methane gas emission intake connected to an emissions line having a backpressure equal to 1 to 3 inches of water (249 to 746 Pa), a natural gas feed for feeding natural gas into the methane-capturing module, may include a relief vent for preventing overpressure within the methane-capturing module and a drain for draining liquids that have condensed within the methane-capturing module. The methane conversion module includes a conversion pad for catalytically converting the captured methane into carbon dioxide and water, a water vapour opening for outputting the water and a carbon dioxide opening for outputting the carbon dioxide.

Abstract: Examples are directed to an approach to specifying design guidelines for fabricating a free-form optical component, and methods of fabricating the free-form optical components. In one example, a family of optical prescriptions is created, and a fabricator may manufacture the free-form optical element to any selected prescription within the family. According to certain examples, the series of prescriptions in the family each describe a very similar optical surface providing the same or similar optical performance, and are layered relative to one another such that the thickness of the optical element at any point is slightly less for each subsequent surface defined by the next prescription in the series.

Abstract: A methane destruction apparatus for capturing and converting fugitive methane gas emissions into carbon dioxide and water comprises a methane-capturing module for capturing the fugitive methane gas emissions and a methane conversion module for receiving captured methane from the methane-capturing module. The methane-capturing module includes a fugitive methane gas emission intake connected to an emissions line having a backpressure equal to 1 to 3 inches of water (249 to 746 Pa), a natural gas feed for feeding natural gas into the methane-capturing module, may include a relief vent for preventing overpressure within the methane-capturing module and a drain for draining liquids that have condensed within the methane-capturing module. The methane conversion module includes a conversion pad for catalytically converting the captured methane into carbon dioxide and water, a water vapour opening for outputting the water and a carbon dioxide opening for outputting the carbon dioxide.

Abstract: A methane converter for converting methane into carbon dioxide and water, the converter comprising a gas feed for feeding methane into the converter, a mesh pad separator for receiving the methane from the gas feed and for separating methane gas from liquid, a drain connected to the separator to drain off the liquid, an air intake for receiving air, a tubular section extending upwardly from the air intake, a methane nozzle connected to the separator for receiving the methane gas from the separator and for discharging the methane gas inside the tubular section at a point downstream of the air intake, a catalyst bed within the tubular section for reacting the methane gas with oxygen in the air to form the carbon dioxide and the water, and an outlet of the tubular section for emitting the carbon dioxide and the water.

Abstract: Provided herein is a stable pharmaceutical composition including meloxicam and methocarbamol in the form of granules, including a meglumine and sodium citrate complex to improve solubility. The pharmaceutical compositions are administered simultaneously and are kept separated in the pharmaceutical form that is administered. Also provided herein are methods for the treatment of disorders associated with muscle, skeletal muscle, and pain.

Abstract: An approach is provided in which a dynamic thermal relief generator retrieves a circuit board file that identifies power plane thru pin locations and a power plane layer. The dynamic thermal relief generator selects one of the power plane thru pin locations and identifies one or more electrical properties corresponding to a component assigned to the selected power plane thru pin location. As such, the dynamic thermal relief generator computes a conductive material exclusion amount based upon the identified electrical properties, which indicates an amount of area to exclude conductive material on the selected power plane layer. In turn, the dynamic thermal relief generator creates a thermal relief pattern based upon the computed conductive material exclusion amount that identifies conductive material voids on the selected power plane layer to exclude the substantially conductive material.

Abstract: An approach is provided in which a dynamic thermal relief generator retrieves a circuit board file that identifies power plane thru pin locations and a power plane layer. The dynamic thermal relief generator selects one of the power plane thru pin locations and identifies one or more electrical properties corresponding to a component assigned to the selected power plane thru pin location. As such, the dynamic thermal relief generator computes a conductive material exclusion amount based upon the identified electrical properties, which indicates an amount of area to exclude conductive material on the selected power plane layer. In turn, the dynamic thermal relief generator creates a thermal relief pattern based upon the computed conductive material exclusion amount that identifies conductive material voids on the selected power plane layer to exclude the substantially conductive material.

Abstract: An approach is in which a dynamic thermal relief generator retrieves a circuit board file that identifies power plane thru pin locations and a power plane layer. The dynamic thermal relief generator selects one of the power plane thru pin locations and creates a thermal relief pattern that includes thermal relief shapes that identify conductive material voids on a power plane layer to exclude substantially conductive material. The dynamic thermal relief generator determines that one of the conductive material voids affects one or more proximate signal tracks and, in turn, automatically adjusts the thermal relief pattern accordingly.

Abstract: A testing method for a silicon interposer employs a test probe and an electrically conductive glass handler. The silicon interposer includes multiple interconnects that extend between the opposed major surfaces of the interposer, namely from a test side of the interposer to a conductive glass handler side of the interposer. On the glass handler side, the interposer includes a layer of patterned insulative resist with open regions at some interconnects on the glass handler side and remaining resist regions at other interconnects on the glass handler side. The interposer may include a conductive adhesive layer that couples together interconnects at the open regions on the glass handler side. In this manner, a probe may send a test signal from a first interconnect at one location on the test side of the interposer, through the first interconnect, through the conductive adhesive, through a second interconnect to another probe on the test side of the interposer.

Abstract: A testing method for a silicon interposer employs a test probe and an electrically conductive glass handler. The silicon interposer includes multiple interconnects that extend between the opposed major surfaces of the interposer, namely from a test side of the interposer to a conductive glass handler side of the interposer. On the glass handler side, the interposer includes a layer of patterned insulative resist with open regions at some interconnects on the glass handler side and remaining resist regions at other interconnects on the glass handler side. The interposer may include a conductive adhesive layer that couples together interconnects at the open regions on the glass handler side. In this manner, a probe may send a test signal from a first interconnect at one location on the test side of the interposer, through the first interconnect, through the conductive adhesive, through a second interconnect to another probe on the test side of the interposer.