Abstract: An injecting gun for the treatment of animals with identification aid with a push button on the handle comprising a body formed by two main housings linked by their edges with delimitate the free space, in which there is an electronic card consisting of: a CPU (Central Processing Unit) which is connected by means of: a) a UART (Universal Asynchronous Receiver/Transmitter) module with connections to: i) a RFID (Radio-Frequency IDentification) module, ii) a wireless connectivity module; and iii) a keyboard; b) a GPIO (General Purpose Input/Output) module with connections to: iii) a plurality of LEDs (Light Emitting Diode), iv) a vibrator, vi) a buzzer, vii) a syringe sensor, viii) a verification sensor, and ix) a TFT (Thin-Film Transistor) liquid crystal parallel port; c) a USB module (Universal Serial Bus) with: x) a micro USB plug (micro USB); wherein, said CPU is connected to a memory; and wherein said CPU is connected to an energy source, which is connected to a charger and energy manager.

Abstract: An injecting gun for the treatment of animals with identification aid with a push button on the handle comprising a body formed by two main housings linked by their edges with delimitate the free space, in which there is an electronic card consisting of: a CPU (Central Processing Unit) which is connected by means of: a) UART (Universal Asynchronous Receiver/Transmitter) modules with: i) a RFID UHF module, and ii) a Bluetooth module; b) GPIO (General Purpose input/Output) modules with: iii) a plurality of LEDs (Light Emitting Diode), iv) a vibrator, vi) a buzzer vii) a syringe sensor, viii) two touch switches, and ix) a TFT (Thin-Film Transistor) liquid crystal parallel port; c) a USB module (Universal Serial Bus) with: x) a micro USB plug (micro USB); wherein, said CPU is connected to a memory; and wherein said CPU is connected to an energy source, which is connected to a charger and energy manager.

Abstract: An injecting gun with driven built-in counter, having a loading tube with a support for a needle at its distal end and a sliding plunger attached to a rod with transversal slots ending in a handle; a trigger associated with a cam that, when triggered, pushes the rod through the slots where said cam is settled, and a body including therein an electronic card constituted by a CPU connected to: a) GPIO modules connected with: i) a plurality of tactile switches, ii) a balance switch, iii) a OLED display, iv) a keyboard with associated LEDs, v) a buzzer, and vi) a speaker; y b) a USB module connected with: vii) a micro USB plug; wherein, said CPU is linked to a memory; tactile switches are associated to the trigger; and an energy source with energy manager is connected to said CPU and modules providing the energy needed for functioning.

Abstract: A product display assembly (100) includes a product display device (110) and a security device (160). The display device (110) includes a boom (112) and a peg hook (114). The hook (114) exhibits merchandise along a length of the hook (114). The security device (160) includes a base (118), an arm portion (164) pivotally mounted to the base (118) for rotation, and a foot portion (166) coupled to and extending away from the arm portion (164). In a securing position, movement of merchandise (130) contacts the security device (160). In a retrieval position, the security device (160) is rotated away from the peg hook (114) such that movement of merchandise does not contact the security device (160) and merchandise (130) is removable from the hook (114). In a locking position, the security device (160) rotates away from the hook (114) by continuing contact with the merchandise (130).

Abstract: A product display assembly (100) includes a product display device (110) and a security device (160). The display device (110) includes a boom (112) and a peg hook (114). The hook (114) exhibits merchandise along a length of the hook (114). The security device (160) includes a base (118), an arm portion (164) pivotally mounted to the base (118) for rotation, and a foot portion (166) coupled to and extending away from the arm portion (164). In a securing position, movement of merchandise (130) contacts the security device (160). In a retrieval position, the security device (160) is rotated away from the peg hook (114) such that movement of merchandise does not contact the security device (160) and merchandise (130) is removable from the hook (114). In a locking position, the security device (160) rotates away from the hook (114) by continuing contact with the merchandise (130).

Abstract: A product display includes an elongated member having at least one channel extending in a direction substantially parallel with the length of the member, a product support engaged with the elongated member, and a product divider engaged with the elongated member. At least one of the product support and the product divider is at least partially received within the channel. The product support and the product divider are independently movable relative to one another along the length of the elongated member to adjust the respective positions of the product support and the product divider relative to the elongated member.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a subcarrier (354) having an outer surface (378) with an annular first membrane (376) coupled thereto. The first membrane (376) has a receiving surface (380) adapted to receive the substrate (356) thereon, and a lip (382) adapted to seal with a backside of the substrate to define a first chamber (384) therebetween. A second membrane (386) positioned above the first membrane (376), and coupled to the subcarrier (354) defines a second chamber (388). During a polishing operation pressurized fluid introduced into the second chamber (388) causes it to expand outward to exert a force on a portion of the backside of the substrate (356), thereby pressing a predetermined area (392) of the surface of the substrate against the polishing pad. The predetermined area (392) is directly proportional to the pressure of the fluid introduced into the second chamber (388).

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a subcarrier (354) having an outer surface (378) with an annular first membrane (376) coupled thereto. The first membrane (376) has a receiving surface (380) adapted to receive the substrate (356) thereon, and a lip (382) adapted to seal with a backside of the substrate to define a first chamber (384) therebetween. A second membrane (386) positioned above the first membrane (376), and coupled to the subcarrier (354) defines a second chamber (388). During a polishing operation pressurized fluid introduced into the second chamber (388) causes it to expand outward to exert a force on a portion of the backside of the substrate (356), thereby pressing a predetermined area (392) of the surface of the substrate against the polishing pad. The predetermined area (392) is directly proportional to the pressure of the fluid introduced into the second chamber (388).