Patents by Inventor Alejo M. Lifschitz Arribio

Alejo M. Lifschitz Arribio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of enhancing copper electroplating
    Patent number: 11686006
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 27, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Method of enhancing copper electroplating
    Patent number: 11512406
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 29, 2022
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20220228282
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 21, 2022
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • PHOTORESIST RESOLUTION CAPABILITIES BY COPPER ELECTROPLATING ANISOTROPICALLY
    Publication number: 20220213610
    Abstract: Features of substrates are copper electroplated by a method which involves copper electroplating selectively deposited seed layers or seed layers of photoresist defined features with a copper electroplating composition containing select suppressor compounds and select leveler compounds which enable anisotropic plating. Optionally, the seed layers can be treated with an aqueous solution of sulfur containing accelerators prior to copper electroplating.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Inventors: Alejo M. Lifschitz Arribio, Alexander Zielinski, Samer Hammoodi, Joseph F. Lachowski, Michael K. Gallagher, Curtis Williamson, Jonathan D. Prange
  • METHOD OF ENHANCING COPPER ELECTROPLATING
    Publication number: 20210115581
    Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.
    Type: Application
    Filed: September 21, 2020
    Publication date: April 22, 2021
    Inventors: Alejo M. Lifschitz Arribio, Jonathan D. Prange, Michael K. Gallagher, Alexander Zielinski, Luis A. Gomez, Joseph F. Lachowski
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10655227
    Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 19, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10590541
    Abstract: Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: March 17, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190382900
    Abstract: Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: May 1, 2019
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Patricia Gumbley, Michael Lipschutz, Feng Liu, Catherine Mulzer, Sarah Wen
  • ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190382901
    Abstract: Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: May 1, 2019
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Patricia Gumbley, Michael Lipschutz, Feng Liu, Catherine Mulzer, Sarah Wen
  • ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190382899
    Abstract: Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10294569
    Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 21, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190106792
    Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Application
    Filed: July 13, 2018
    Publication date: April 11, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190106793
    Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Application
    Filed: July 13, 2018
    Publication date: April 11, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary