Patents by Inventor Aleksander Vaysman

Aleksander Vaysman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10849228
    Abstract: A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density fins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: November 24, 2020
    Assignee: Telephonics Corporation
    Inventors: George McPartland, Aleksander Vaysman
  • Publication number: 20200352030
    Abstract: A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density fins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
    Type: Application
    Filed: July 7, 2020
    Publication date: November 5, 2020
    Applicant: Telephonics Corporation
    Inventors: George McPartland, Aleksander Vaysman
  • Patent number: 10757809
    Abstract: A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density tins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: August 25, 2020
    Assignee: Telephonics Corporation
    Inventors: George McPartland, Aleksander Vaysman